JPS57166051A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57166051A JPS57166051A JP5344481A JP5344481A JPS57166051A JP S57166051 A JPS57166051 A JP S57166051A JP 5344481 A JP5344481 A JP 5344481A JP 5344481 A JP5344481 A JP 5344481A JP S57166051 A JPS57166051 A JP S57166051A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- substrate
- layers
- wiring
- mutually
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 8
- 239000002184 metal Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344481A JPS57166051A (en) | 1981-04-06 | 1981-04-06 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5344481A JPS57166051A (en) | 1981-04-06 | 1981-04-06 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166051A true JPS57166051A (en) | 1982-10-13 |
| JPS6220707B2 JPS6220707B2 (enrdf_load_stackoverflow) | 1987-05-08 |
Family
ID=12943019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5344481A Granted JPS57166051A (en) | 1981-04-06 | 1981-04-06 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166051A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61139014U (enrdf_load_stackoverflow) * | 1985-02-18 | 1986-08-28 | ||
| US4628406A (en) * | 1985-05-20 | 1986-12-09 | Tektronix, Inc. | Method of packaging integrated circuit chips, and integrated circuit package |
| JPS6332958A (ja) * | 1986-05-07 | 1988-02-12 | デイジタル イクイプメントコ−ポレ−シヨン | 導体基板上に半導体を取外し可能に取付けるシステム |
| US5014161A (en) * | 1985-07-22 | 1991-05-07 | Digital Equipment Corporation | System for detachably mounting semiconductors on conductor substrate |
| JPH07297560A (ja) * | 1994-04-28 | 1995-11-10 | Hitachi Ltd | 多層プリント配線基板およびその実装構造体 |
| EP0722186A3 (en) * | 1995-01-13 | 1997-04-23 | Murata Manufacturing Co | Laminated electronic device |
| WO1998004000A1 (en) * | 1996-07-22 | 1998-01-29 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| US8441118B2 (en) | 2005-06-30 | 2013-05-14 | Intel Corporation | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
-
1981
- 1981-04-06 JP JP5344481A patent/JPS57166051A/ja active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61139014U (enrdf_load_stackoverflow) * | 1985-02-18 | 1986-08-28 | ||
| US4628406A (en) * | 1985-05-20 | 1986-12-09 | Tektronix, Inc. | Method of packaging integrated circuit chips, and integrated circuit package |
| US5014161A (en) * | 1985-07-22 | 1991-05-07 | Digital Equipment Corporation | System for detachably mounting semiconductors on conductor substrate |
| JPS6332958A (ja) * | 1986-05-07 | 1988-02-12 | デイジタル イクイプメントコ−ポレ−シヨン | 導体基板上に半導体を取外し可能に取付けるシステム |
| JPH07297560A (ja) * | 1994-04-28 | 1995-11-10 | Hitachi Ltd | 多層プリント配線基板およびその実装構造体 |
| EP0722186A3 (en) * | 1995-01-13 | 1997-04-23 | Murata Manufacturing Co | Laminated electronic device |
| US6004657A (en) * | 1995-01-13 | 1999-12-21 | Murata Manufacturing Co., Ltd. | Laminated electronic part |
| WO1998004000A1 (en) * | 1996-07-22 | 1998-01-29 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, connecting structure between wiring board and plug member, connecting unit between electronic parts and wiring board, and electronic parts mounting method |
| US6720500B1 (en) * | 1996-07-22 | 2004-04-13 | Honda Giken Kogyo Kabushiki Kaisha | Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| US8441118B2 (en) | 2005-06-30 | 2013-05-14 | Intel Corporation | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
| TWI470753B (zh) * | 2005-06-30 | 2015-01-21 | Intel Corp | 線互連物件及包含該物件之計算系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6220707B2 (enrdf_load_stackoverflow) | 1987-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5731166A (en) | Semiconductor device | |
| JPS5471572A (en) | Semiconductor device | |
| MY116347A (en) | Electronic package with multilevel connections | |
| JPS57166051A (en) | Semiconductor device | |
| FR2557755B1 (fr) | Substrat de cablage multi-couche | |
| JPS5769765A (en) | Sealed body of semiconductor device | |
| GB1240977A (en) | Improvements in or relating to semiconductor components | |
| GB8305761D0 (en) | Integrated circuit packaging | |
| JPS6486543A (en) | Semiconductor mounting cooling structure | |
| JPS57126154A (en) | Lsi package | |
| JPS56148857A (en) | Semiconductor device | |
| JPS6431443A (en) | Semiconductor device | |
| JPS6459947A (en) | Semiconductor device | |
| JPS6473753A (en) | Semiconductor integrated circuit device | |
| JPS6489350A (en) | Package for containing semiconductor element | |
| JPS55165657A (en) | Multi-chip package | |
| JPS57136352A (en) | Semiconductor device of resin potted type | |
| JPS57166052A (en) | Semiconductor device | |
| JPS57204154A (en) | Structure of chip carrier | |
| JPS5559746A (en) | Semiconductor device and its mounting circuit device | |
| JPS56105656A (en) | Semiconductor device | |
| JPS53110371A (en) | Ceramic package type semiconductor device | |
| JPS57114242A (en) | Semiconductor device | |
| JPS57121239A (en) | Semiconductor device | |
| JPS644053A (en) | Semiconductor device |