JPS57164982A - Etching method - Google Patents

Etching method

Info

Publication number
JPS57164982A
JPS57164982A JP4961881A JP4961881A JPS57164982A JP S57164982 A JPS57164982 A JP S57164982A JP 4961881 A JP4961881 A JP 4961881A JP 4961881 A JP4961881 A JP 4961881A JP S57164982 A JPS57164982 A JP S57164982A
Authority
JP
Japan
Prior art keywords
etching
layer
sputtering
copper
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4961881A
Other languages
Japanese (ja)
Inventor
Junzo Toda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4961881A priority Critical patent/JPS57164982A/en
Publication of JPS57164982A publication Critical patent/JPS57164982A/en
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To perform accurate etching visually in removing of etching on a coating layer formed on a conductive material layer of which the hue is changed by the film formed on the surface by discriminating etching condition from the change in the hue.
CONSTITUTION: For example, a copper layer 2 is deposited on a substrate 1 by vapor deposition or sputtering, after which it is heat-treated in air. Right after sputtering, said layer forms a metallic copper color but after the heat treatment, the copper surface is oxidize to form an oxidized film 3, thereby forming a reddish brown color. An Al2O3 layer 4 is deposited by vapor deposition or sputtering thereon, and is formed with required resist patterns by using a photoresist 5. This sample is immersed in a heated phosphoric acid, whereby Al2O3 is etched. The etching ends at the point of the time when the Al2O3 is etched and the copper surface of the reddish brown color changes to a metallic copper color.
COPYRIGHT: (C)1982,JPO&Japio
JP4961881A 1981-04-02 1981-04-02 Etching method Pending JPS57164982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4961881A JPS57164982A (en) 1981-04-02 1981-04-02 Etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4961881A JPS57164982A (en) 1981-04-02 1981-04-02 Etching method

Publications (1)

Publication Number Publication Date
JPS57164982A true JPS57164982A (en) 1982-10-09

Family

ID=12836215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4961881A Pending JPS57164982A (en) 1981-04-02 1981-04-02 Etching method

Country Status (1)

Country Link
JP (1) JPS57164982A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0331487A (en) * 1989-06-26 1991-02-12 Hon Chen Ron Labeled development
JPH0738172A (en) * 1993-06-28 1995-02-07 Nec Corp Magnetoresistance device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0331487A (en) * 1989-06-26 1991-02-12 Hon Chen Ron Labeled development
JPH0738172A (en) * 1993-06-28 1995-02-07 Nec Corp Magnetoresistance device

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