JPS57157561A - Non-destructive read-out semiconductor memory - Google Patents

Non-destructive read-out semiconductor memory

Info

Publication number
JPS57157561A
JPS57157561A JP56042188A JP4218881A JPS57157561A JP S57157561 A JPS57157561 A JP S57157561A JP 56042188 A JP56042188 A JP 56042188A JP 4218881 A JP4218881 A JP 4218881A JP S57157561 A JPS57157561 A JP S57157561A
Authority
JP
Japan
Prior art keywords
region
layer
type
becoming
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56042188A
Other languages
Japanese (ja)
Inventor
Tadahide Takada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56042188A priority Critical patent/JPS57157561A/en
Publication of JPS57157561A publication Critical patent/JPS57157561A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices

Landscapes

  • Read Only Memory (AREA)
  • Semiconductor Memories (AREA)

Abstract

PURPOSE:To obtain a large capacity RAM in which charge can be effectively inputted and outputted by reducing a potential barrier between a substrate and a charge storage region by utilizing two-dimensional field effect in the vicinity of source and drain regions and producing a charge conduction path in the source and drain regions. CONSTITUTION:An N type ion implanted layer 2 becoming a well is formed on a P type Si substrate 4, and an N<+> type region 11 becoming the drain and bit line of a memory cell transistor and an N<+> type region becoming the source and word line of the transistor are diffused and formed at the prescribed interval in the layer 2. Then, a P type ion implanted layer 8 is formed on the surface layer part of the layer 2 disposed at the intermediate of the regions 11, 12, a thin gate oxidized film 6 is covered on the layer 8, and a polycrystaline Si gate electrode 1 is covered from the above of the film 6 over the ends of the regions 11, 12. With this structure, a read/write voltage VW/R is applied to the electrode 1, a bit line voltage BB is applied to the region 11, a word line voltage Vw applied to the region 12 is varied, and the state of ''1'' or ''0'' is selected according to whether or not holes are stored in the region 8.
JP56042188A 1981-03-23 1981-03-23 Non-destructive read-out semiconductor memory Pending JPS57157561A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042188A JPS57157561A (en) 1981-03-23 1981-03-23 Non-destructive read-out semiconductor memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042188A JPS57157561A (en) 1981-03-23 1981-03-23 Non-destructive read-out semiconductor memory

Publications (1)

Publication Number Publication Date
JPS57157561A true JPS57157561A (en) 1982-09-29

Family

ID=12629025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042188A Pending JPS57157561A (en) 1981-03-23 1981-03-23 Non-destructive read-out semiconductor memory

Country Status (1)

Country Link
JP (1) JPS57157561A (en)

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