JPS6433961A - Mos composite memory device - Google Patents

Mos composite memory device

Info

Publication number
JPS6433961A
JPS6433961A JP18934187A JP18934187A JPS6433961A JP S6433961 A JPS6433961 A JP S6433961A JP 18934187 A JP18934187 A JP 18934187A JP 18934187 A JP18934187 A JP 18934187A JP S6433961 A JPS6433961 A JP S6433961A
Authority
JP
Japan
Prior art keywords
section
mos transistor
floating gate
gate
nonvolatile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18934187A
Other languages
Japanese (ja)
Inventor
Kenichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP18934187A priority Critical patent/JPS6433961A/en
Publication of JPS6433961A publication Critical patent/JPS6433961A/en
Pending legal-status Critical Current

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Landscapes

  • Read Only Memory (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)

Abstract

PURPOSE:To enable a function as a nonvolatile RAM to be obtained in a small occupied area, by forming a memory cell which consists of substantial three transistors including a nonvolatile MOS transistor memory with a floating gate and one capacitor element in one semiconductor substrate. CONSTITUTION:A memory cell comprises a DRAM section including a first MOS transistor MT1 which is connected to a capacitor C, a nonvolatile memory section MT2 with a floating gate FG which is connected to the DRAM section, and a second MOS transistor MT3 which is connected to the nonvolatile memory section MT2. And, the DRAM section, the nonvolatile memory section MT2 and the second MOS transistor MT3 are formed together in the same semiconductor substrate. For example, a gate electrode 15 is formed over between a drain area 12 and a diffusion area 13 through a gate oxide film to the transistor MT1 for selecting element. And, an electrode 16 for forming the capacitor C is superposed on the diffusion area 13 through the oxide film, and a floating gate 17 is so formed as to have an insulating film section A with very thin thickness for writing and erasing over a part of the diffusion area 13; moreover, a control gate 18 is formed over the floating gate 17.
JP18934187A 1987-07-29 1987-07-29 Mos composite memory device Pending JPS6433961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18934187A JPS6433961A (en) 1987-07-29 1987-07-29 Mos composite memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18934187A JPS6433961A (en) 1987-07-29 1987-07-29 Mos composite memory device

Publications (1)

Publication Number Publication Date
JPS6433961A true JPS6433961A (en) 1989-02-03

Family

ID=16239713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18934187A Pending JPS6433961A (en) 1987-07-29 1987-07-29 Mos composite memory device

Country Status (1)

Country Link
JP (1) JPS6433961A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03134894A (en) * 1989-10-19 1991-06-07 Sharp Corp Semiconductor memory device
KR20020046684A (en) * 2000-12-15 2002-06-21 박종섭 Structure of EEPROM and method for manufacturing the same
KR100328743B1 (en) * 1995-11-28 2002-10-31 삼성전자 주식회사 Ferroelectric dynamic random access memory
WO2009078456A1 (en) 2007-12-19 2009-06-25 Soshin Electric Co., Ltd. High frequency switch

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03134894A (en) * 1989-10-19 1991-06-07 Sharp Corp Semiconductor memory device
KR100328743B1 (en) * 1995-11-28 2002-10-31 삼성전자 주식회사 Ferroelectric dynamic random access memory
KR20020046684A (en) * 2000-12-15 2002-06-21 박종섭 Structure of EEPROM and method for manufacturing the same
WO2009078456A1 (en) 2007-12-19 2009-06-25 Soshin Electric Co., Ltd. High frequency switch

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