JPS57157554A - Lead material with excellent heat resistance and conductivity for semiconductor device - Google Patents

Lead material with excellent heat resistance and conductivity for semiconductor device

Info

Publication number
JPS57157554A
JPS57157554A JP56043404A JP4340481A JPS57157554A JP S57157554 A JPS57157554 A JP S57157554A JP 56043404 A JP56043404 A JP 56043404A JP 4340481 A JP4340481 A JP 4340481A JP S57157554 A JPS57157554 A JP S57157554A
Authority
JP
Japan
Prior art keywords
lead material
plate
heat resistance
produce
excellent heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56043404A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218615B2 (enExample
Inventor
Rensei Futatsuka
Tadao Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP56043404A priority Critical patent/JPS57157554A/ja
Publication of JPS57157554A publication Critical patent/JPS57157554A/ja
Publication of JPS6218615B2 publication Critical patent/JPS6218615B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56043404A 1981-03-25 1981-03-25 Lead material with excellent heat resistance and conductivity for semiconductor device Granted JPS57157554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56043404A JPS57157554A (en) 1981-03-25 1981-03-25 Lead material with excellent heat resistance and conductivity for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56043404A JPS57157554A (en) 1981-03-25 1981-03-25 Lead material with excellent heat resistance and conductivity for semiconductor device

Publications (2)

Publication Number Publication Date
JPS57157554A true JPS57157554A (en) 1982-09-29
JPS6218615B2 JPS6218615B2 (enExample) 1987-04-23

Family

ID=12662820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56043404A Granted JPS57157554A (en) 1981-03-25 1981-03-25 Lead material with excellent heat resistance and conductivity for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57157554A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911659A (ja) * 1982-07-12 1984-01-21 Tamagawa Kikai Kinzoku Kk 半導体用リ−ド材

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0175822U (enExample) * 1987-11-11 1989-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911659A (ja) * 1982-07-12 1984-01-21 Tamagawa Kikai Kinzoku Kk 半導体用リ−ド材

Also Published As

Publication number Publication date
JPS6218615B2 (enExample) 1987-04-23

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