JPS5715450A - Apparatus for water cooling electrical circuit element - Google Patents
Apparatus for water cooling electrical circuit elementInfo
- Publication number
- JPS5715450A JPS5715450A JP8972080A JP8972080A JPS5715450A JP S5715450 A JPS5715450 A JP S5715450A JP 8972080 A JP8972080 A JP 8972080A JP 8972080 A JP8972080 A JP 8972080A JP S5715450 A JPS5715450 A JP S5715450A
- Authority
- JP
- Japan
- Prior art keywords
- water
- water channel
- dissolving
- high voltage
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 title 1
- 239000000498 cooling water Substances 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 2
- 239000010935 stainless steel Substances 0.000 abstract 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract 2
- 229910018487 Ni—Cr Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8972080A JPS5715450A (en) | 1980-06-30 | 1980-06-30 | Apparatus for water cooling electrical circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8972080A JPS5715450A (en) | 1980-06-30 | 1980-06-30 | Apparatus for water cooling electrical circuit element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5715450A true JPS5715450A (en) | 1982-01-26 |
| JPS6232621B2 JPS6232621B2 (enrdf_load_stackoverflow) | 1987-07-15 |
Family
ID=13978596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8972080A Granted JPS5715450A (en) | 1980-06-30 | 1980-06-30 | Apparatus for water cooling electrical circuit element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5715450A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007101693A1 (de) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur kühlung, insbesondere elektronischer bauelemente |
| CN111361461A (zh) * | 2020-04-23 | 2020-07-03 | 青岛瑞帆智业管理咨询有限公司 | 一种有轨电车第三轨供电结构 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827644U (enrdf_load_stackoverflow) * | 1971-08-03 | 1973-04-03 | ||
| JPS4946111A (enrdf_load_stackoverflow) * | 1972-09-11 | 1974-05-02 | ||
| JPS5530852A (en) * | 1978-08-25 | 1980-03-04 | Nec Corp | Water cooling heatsink for semiconductor element |
-
1980
- 1980-06-30 JP JP8972080A patent/JPS5715450A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827644U (enrdf_load_stackoverflow) * | 1971-08-03 | 1973-04-03 | ||
| JPS4946111A (enrdf_load_stackoverflow) * | 1972-09-11 | 1974-05-02 | ||
| JPS5530852A (en) * | 1978-08-25 | 1980-03-04 | Nec Corp | Water cooling heatsink for semiconductor element |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007101693A1 (de) * | 2006-03-09 | 2007-09-13 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur kühlung, insbesondere elektronischer bauelemente |
| CN111361461A (zh) * | 2020-04-23 | 2020-07-03 | 青岛瑞帆智业管理咨询有限公司 | 一种有轨电车第三轨供电结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6232621B2 (enrdf_load_stackoverflow) | 1987-07-15 |
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