JPS6232621B2 - - Google Patents

Info

Publication number
JPS6232621B2
JPS6232621B2 JP55089720A JP8972080A JPS6232621B2 JP S6232621 B2 JPS6232621 B2 JP S6232621B2 JP 55089720 A JP55089720 A JP 55089720A JP 8972080 A JP8972080 A JP 8972080A JP S6232621 B2 JPS6232621 B2 JP S6232621B2
Authority
JP
Japan
Prior art keywords
water
cooling
electric circuit
metal
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55089720A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5715450A (en
Inventor
Shigeo Kobayashi
Hideki Takahashi
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8972080A priority Critical patent/JPS5715450A/ja
Publication of JPS5715450A publication Critical patent/JPS5715450A/ja
Publication of JPS6232621B2 publication Critical patent/JPS6232621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP8972080A 1980-06-30 1980-06-30 Apparatus for water cooling electrical circuit element Granted JPS5715450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8972080A JPS5715450A (en) 1980-06-30 1980-06-30 Apparatus for water cooling electrical circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8972080A JPS5715450A (en) 1980-06-30 1980-06-30 Apparatus for water cooling electrical circuit element

Publications (2)

Publication Number Publication Date
JPS5715450A JPS5715450A (en) 1982-01-26
JPS6232621B2 true JPS6232621B2 (enrdf_load_stackoverflow) 1987-07-15

Family

ID=13978596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8972080A Granted JPS5715450A (en) 1980-06-30 1980-06-30 Apparatus for water cooling electrical circuit element

Country Status (1)

Country Link
JP (1) JPS5715450A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006011333A1 (de) * 2006-03-09 2007-09-13 Behr Industry Gmbh & Co. Kg Vorrichtung zur Kühlung, insbesondere elektronischer Bauelemente
CN111361461A (zh) * 2020-04-23 2020-07-03 青岛瑞帆智业管理咨询有限公司 一种有轨电车第三轨供电结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043294Y2 (enrdf_load_stackoverflow) * 1971-08-03 1975-12-11
JPS4946111A (enrdf_load_stackoverflow) * 1972-09-11 1974-05-02
JPS5530852A (en) * 1978-08-25 1980-03-04 Nec Corp Water cooling heatsink for semiconductor element

Also Published As

Publication number Publication date
JPS5715450A (en) 1982-01-26

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