JPS57153456A - Sealing for electronic component parts - Google Patents

Sealing for electronic component parts

Info

Publication number
JPS57153456A
JPS57153456A JP56038856A JP3885681A JPS57153456A JP S57153456 A JPS57153456 A JP S57153456A JP 56038856 A JP56038856 A JP 56038856A JP 3885681 A JP3885681 A JP 3885681A JP S57153456 A JPS57153456 A JP S57153456A
Authority
JP
Japan
Prior art keywords
unit
sealing
polyimid
sulphite
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56038856A
Other languages
Japanese (ja)
Inventor
Yoshihiro Kubota
Osamu Kuriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP56038856A priority Critical patent/JPS57153456A/en
Publication of JPS57153456A publication Critical patent/JPS57153456A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To perform a sealing of high quality by a method wherein the surface of electronic parts is protected with a predetermined precoat material beforehand and is sealed with polyphenylene sulphite resin. CONSTITUTION:Polypheylene sulphite containing Ph-S of 80mol% or much is used for repetition unit. However, of the composition units, copolymerization unit such as ether unit, sulphone unit, etc. is contained less than 20mol%. Further, inorganic charged material, cosmetics, parting agent and lubricatnt are added if necessary. Silicon, Si polyimid, Si epoxy resin and polyimid are used for the precoat material. After coating the surface of electronic parts with the appropriate material, the surface is sealed with the predetermined polyphenylene sulphite system resin. According to such a constitution, a sealing body can be obtained wherein it can be sticked strictly to a frame or lead, a forming cycle is established in a short time, a recycling of trash can be used and is excellent humidity resistance, electric property in high temperature and mechanical strength.
JP56038856A 1981-03-18 1981-03-18 Sealing for electronic component parts Pending JPS57153456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56038856A JPS57153456A (en) 1981-03-18 1981-03-18 Sealing for electronic component parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56038856A JPS57153456A (en) 1981-03-18 1981-03-18 Sealing for electronic component parts

Publications (1)

Publication Number Publication Date
JPS57153456A true JPS57153456A (en) 1982-09-22

Family

ID=12536839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56038856A Pending JPS57153456A (en) 1981-03-18 1981-03-18 Sealing for electronic component parts

Country Status (1)

Country Link
JP (1) JPS57153456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301565A2 (en) * 1987-07-31 1989-02-01 Kabushiki Kaisha Toshiba Semiconductor device comprising a wiring layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301565A2 (en) * 1987-07-31 1989-02-01 Kabushiki Kaisha Toshiba Semiconductor device comprising a wiring layer
US5101259A (en) * 1987-07-31 1992-03-31 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof

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