JPS5712025A - Production of molding resin - Google Patents

Production of molding resin

Info

Publication number
JPS5712025A
JPS5712025A JP8514280A JP8514280A JPS5712025A JP S5712025 A JPS5712025 A JP S5712025A JP 8514280 A JP8514280 A JP 8514280A JP 8514280 A JP8514280 A JP 8514280A JP S5712025 A JPS5712025 A JP S5712025A
Authority
JP
Japan
Prior art keywords
epoxy resin
mixed
melt
inorg
compsn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8514280A
Other languages
Japanese (ja)
Other versions
JPS626572B2 (en
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Masanori Segawa
Yasuhide Sugawara
Kunihiko Nishi
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP8514280A priority Critical patent/JPS5712025A/en
Publication of JPS5712025A publication Critical patent/JPS5712025A/en
Publication of JPS626572B2 publication Critical patent/JPS626572B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To produce a molding resing which gives molded articles having high reliability and output, by a method wherein an epoxy resin and a phenolic resin hardener (one of them being solid and the other being liquid) are melt-mixed, and then an inorg. filler and a curing promotor are melt-mixed with the resulting mixture.
CONSTITUTION: In a process for the production of a molding resin employing an epoxy resin compsn. contg. an epoxy resin having at least two epoxy groups per molecule, a phenolic resin hardener having at least two hydroxyl groups per molecule, a curing promotor and an inorg. filler powder, at least one component selected from the epoxy resin and the phenolic resin hardener is solid and the other is liquid or viscous. A mixture of the epoxy resin and the phenolic resin hardener excluding the curing promotor is previously melt-mixed and then the whole epoxy resin compsn. contg. 55W70vol% (based on the entire volume of the compsn.) said inorg. filler powder, is melt-mixed.
COPYRIGHT: (C)1982,JPO&Japio
JP8514280A 1980-06-25 1980-06-25 Production of molding resin Granted JPS5712025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8514280A JPS5712025A (en) 1980-06-25 1980-06-25 Production of molding resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8514280A JPS5712025A (en) 1980-06-25 1980-06-25 Production of molding resin

Publications (2)

Publication Number Publication Date
JPS5712025A true JPS5712025A (en) 1982-01-21
JPS626572B2 JPS626572B2 (en) 1987-02-12

Family

ID=13850404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8514280A Granted JPS5712025A (en) 1980-06-25 1980-06-25 Production of molding resin

Country Status (1)

Country Link
JP (1) JPS5712025A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186166U (en) * 1982-06-04 1983-12-10 ヤンマーディーゼル株式会社 row type fuel injection pump
JPS6151949A (en) * 1984-08-22 1986-03-14 Mitsubishi Electric Corp Resin-sealed semiconductor device
JPH0669259A (en) * 1993-06-14 1994-03-11 Nitto Denko Corp Resin tablet for sealing semiconductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165946A (en) * 1979-06-14 1980-12-24 Hitachi Chem Co Ltd Production of epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165946A (en) * 1979-06-14 1980-12-24 Hitachi Chem Co Ltd Production of epoxy resin composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186166U (en) * 1982-06-04 1983-12-10 ヤンマーディーゼル株式会社 row type fuel injection pump
JPS6151949A (en) * 1984-08-22 1986-03-14 Mitsubishi Electric Corp Resin-sealed semiconductor device
JPH0669259A (en) * 1993-06-14 1994-03-11 Nitto Denko Corp Resin tablet for sealing semiconductor
JP2576018B2 (en) * 1993-06-14 1997-01-29 日東電工株式会社 Resin tablet for semiconductor encapsulation

Also Published As

Publication number Publication date
JPS626572B2 (en) 1987-02-12

Similar Documents

Publication Publication Date Title
JPS5717153A (en) Sealing method of electronic parts
ES8700297A1 (en) Chemically curable resins derived from 1-oxa-3-aza-tetralin groups containing compounds and cycloaliphatic epoxy resins, process for their preparation and cure as well as the use of such resins.
ES426094A1 (en) Process for the manufacture of structural elements
JPS5712025A (en) Production of molding resin
ES394678A1 (en) Thermosetting epoxy resins
JPS5236141A (en) Process for manufacturing mica-thermoplastic resin composite materials
JPS56116742A (en) Synthetic resin composition
JPS53123457A (en) Molding resin composition
JPS56133856A (en) Epoxy resin composition for sealing semiconductor
JPS56135584A (en) Molded sealing material
ES8605843A1 (en) Mixture for the preparation of acid-resistant sealants and impregnated products, method for their preparation and their use.
JPS5235779A (en) Method of producing macroporous anion-exchange resin
JPS5380000A (en) Process for curing epoxy compound
JPS55156341A (en) Resin composition for realing electronic parts
JPS5228538A (en) Process for preparing thermoplastic resin compositions containing inor ganic fillers
JPS51144453A (en) Preparation of polyamide resin chips
JPS5226554A (en) Process for producing powdered molding materials based on thermosettin g resins
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS5537351A (en) Method of forming fiber reinforced plastic
JPS5325698A (en) Non-crystallizing epoxy resin composition
JPS56104926A (en) Epoxy resin composition for sealing electronic parts
JPS5317698A (en) Preparation of epoxy resin varnishes
JPS5211298A (en) Epoxy resin compositions
JPS56141316A (en) Epoxy resin composition
JPS52148533A (en) Coating compounds