JPS55165946A - Production of epoxy resin composition - Google Patents
Production of epoxy resin compositionInfo
- Publication number
- JPS55165946A JPS55165946A JP7533179A JP7533179A JPS55165946A JP S55165946 A JPS55165946 A JP S55165946A JP 7533179 A JP7533179 A JP 7533179A JP 7533179 A JP7533179 A JP 7533179A JP S55165946 A JPS55165946 A JP S55165946A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- novolak type
- resin
- average
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To obtain a resin composition having a high heat distortion temperature or a glass transition point and excellent thermal shock resistance, by melt-blending a phenolic novolak type epoxy resin with a novolak type phenolic resin, and adding an inorganic filler to the resulting blend.
CONSTITUTION: A liquid or semi-solid phenolic novolak type epoxy resin having at least two epoxy groups in the molecule and an average MW of 300W800, is melt-blended with a novolak type phenolic resin having a softening point of 70W 130°C, at a temperature higher than the softening point of the novolak type phenolic resin. To the resulting blend is added 60W75vol% of an inorganic filler. If an epoxy resin having an average MW of below 300 is used instead of using said epoxy resin, the resulting blend with the novolak type phenolic resin is difficult to solidify and gives rise to operational problems, whereas if an epoxy resin having >800 average MW is used, the addition of the inorganic filler to a proportion of 60W75vol% is difficult.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7533179A JPS55165946A (en) | 1979-06-14 | 1979-06-14 | Production of epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7533179A JPS55165946A (en) | 1979-06-14 | 1979-06-14 | Production of epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55165946A true JPS55165946A (en) | 1980-12-24 |
JPS638138B2 JPS638138B2 (en) | 1988-02-20 |
Family
ID=13573161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7533179A Granted JPS55165946A (en) | 1979-06-14 | 1979-06-14 | Production of epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55165946A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712025A (en) * | 1980-06-25 | 1982-01-21 | Hitachi Ltd | Production of molding resin |
JPS57187956A (en) * | 1981-05-07 | 1982-11-18 | Siemens Ag | Electric insulating sealer for semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125596A (en) * | 1974-08-28 | 1976-03-02 | Sumitomo Bakelite Co | EHOKISHIJUSHISOSEIBUTSU NO SEIZOHOHO |
-
1979
- 1979-06-14 JP JP7533179A patent/JPS55165946A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125596A (en) * | 1974-08-28 | 1976-03-02 | Sumitomo Bakelite Co | EHOKISHIJUSHISOSEIBUTSU NO SEIZOHOHO |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5712025A (en) * | 1980-06-25 | 1982-01-21 | Hitachi Ltd | Production of molding resin |
JPS626572B2 (en) * | 1980-06-25 | 1987-02-12 | Hitachi Seisakusho Kk | |
JPS57187956A (en) * | 1981-05-07 | 1982-11-18 | Siemens Ag | Electric insulating sealer for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS638138B2 (en) | 1988-02-20 |
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