JPS57149092A - Silver solder material - Google Patents
Silver solder materialInfo
- Publication number
- JPS57149092A JPS57149092A JP3377881A JP3377881A JPS57149092A JP S57149092 A JPS57149092 A JP S57149092A JP 3377881 A JP3377881 A JP 3377881A JP 3377881 A JP3377881 A JP 3377881A JP S57149092 A JPS57149092 A JP S57149092A
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- silver solder
- silver
- prescribed
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 5
- 229910000679 solder Inorganic materials 0.000 title abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 229910052738 indium Inorganic materials 0.000 abstract 2
- 229910052748 manganese Inorganic materials 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052763 palladium Inorganic materials 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 229910052718 tin Inorganic materials 0.000 abstract 2
- 229910052732 germanium Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3377881A JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438086A Division JPS61216887A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57149092A true JPS57149092A (en) | 1982-09-14 |
| JPS6218275B2 JPS6218275B2 (enExample) | 1987-04-22 |
Family
ID=12395904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3377881A Granted JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57149092A (enExample) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60127093A (ja) * | 1983-12-12 | 1985-07-06 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
| EP1219718A1 (en) * | 2000-12-29 | 2002-07-03 | United Technologies Corporation | Silver braze alloy |
| DE102004040778A1 (de) * | 2004-08-23 | 2006-03-02 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| DE102004040779A1 (de) * | 2004-08-23 | 2006-03-09 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| WO2014111538A2 (de) | 2013-01-18 | 2014-07-24 | Umicore Ag & Co. Kg | Legierungen |
| CN105397334A (zh) * | 2015-12-16 | 2016-03-16 | 郑州机械研究所 | 一种真空环境下使用的银基钎料 |
| CN110238559A (zh) * | 2019-06-17 | 2019-09-17 | 无锡日月合金材料有限公司 | 一种新型四元合金钎料及其制备方法 |
| US10807201B2 (en) * | 2014-11-18 | 2020-10-20 | Baker Hughes Holdings Llc | Braze materials and earth-boring tools comprising braze materials |
| CN112605556A (zh) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | 一种真空器件多级钎焊用钎料及其制备方法 |
| CN114393345A (zh) * | 2021-12-30 | 2022-04-26 | 无锡日月合金材料有限公司 | 一种熔点、流点温度差较小的低银真空焊料 |
-
1981
- 1981-03-11 JP JP3377881A patent/JPS57149092A/ja active Granted
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60127093A (ja) * | 1983-12-12 | 1985-07-06 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
| EP1219718A1 (en) * | 2000-12-29 | 2002-07-03 | United Technologies Corporation | Silver braze alloy |
| US6596229B2 (en) | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| US6936218B2 (en) * | 2000-12-29 | 2005-08-30 | United Technologies Corporation | Silver braze alloy |
| DE102004040779B4 (de) * | 2004-08-23 | 2009-06-18 | Abb Technology Ag | Verwendung von Silberlegierungen als Hartlote |
| DE102004040779A1 (de) * | 2004-08-23 | 2006-03-09 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| DE102004040778A1 (de) * | 2004-08-23 | 2006-03-02 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| DE102004040778B4 (de) * | 2004-08-23 | 2011-11-24 | Umicore Ag & Co. Kg | Silberhartlotlegierungen |
| WO2014111538A2 (de) | 2013-01-18 | 2014-07-24 | Umicore Ag & Co. Kg | Legierungen |
| DE112014000475B4 (de) | 2013-01-18 | 2022-05-25 | Saxonia Technical Materials Gmbh | Lotlegierungen |
| US10807201B2 (en) * | 2014-11-18 | 2020-10-20 | Baker Hughes Holdings Llc | Braze materials and earth-boring tools comprising braze materials |
| CN105397334A (zh) * | 2015-12-16 | 2016-03-16 | 郑州机械研究所 | 一种真空环境下使用的银基钎料 |
| CN110238559A (zh) * | 2019-06-17 | 2019-09-17 | 无锡日月合金材料有限公司 | 一种新型四元合金钎料及其制备方法 |
| CN112605556A (zh) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | 一种真空器件多级钎焊用钎料及其制备方法 |
| CN114393345A (zh) * | 2021-12-30 | 2022-04-26 | 无锡日月合金材料有限公司 | 一种熔点、流点温度差较小的低银真空焊料 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218275B2 (enExample) | 1987-04-22 |
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