JPS57147262A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57147262A
JPS57147262A JP3232081A JP3232081A JPS57147262A JP S57147262 A JPS57147262 A JP S57147262A JP 3232081 A JP3232081 A JP 3232081A JP 3232081 A JP3232081 A JP 3232081A JP S57147262 A JPS57147262 A JP S57147262A
Authority
JP
Japan
Prior art keywords
substrate
lead
region
semiconductor device
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3232081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6155247B2 (index.php
Inventor
Yoshio Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP3232081A priority Critical patent/JPS57147262A/ja
Publication of JPS57147262A publication Critical patent/JPS57147262A/ja
Publication of JPS6155247B2 publication Critical patent/JPS6155247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/042—
    • H10W70/451—
    • H10W70/682—
    • H10W70/685—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP3232081A 1981-03-05 1981-03-05 Manufacture of semiconductor device Granted JPS57147262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3232081A JPS57147262A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3232081A JPS57147262A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57147262A true JPS57147262A (en) 1982-09-11
JPS6155247B2 JPS6155247B2 (index.php) 1986-11-27

Family

ID=12355638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3232081A Granted JPS57147262A (en) 1981-03-05 1981-03-05 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57147262A (index.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57165197U (index.php) * 1981-04-14 1982-10-18

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01227285A (ja) * 1988-03-08 1989-09-11 Sanyo Electric Co Ltd ディスクプレーヤの駆動機構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57165197U (index.php) * 1981-04-14 1982-10-18

Also Published As

Publication number Publication date
JPS6155247B2 (index.php) 1986-11-27

Similar Documents

Publication Publication Date Title
KR880008730A (ko) 플렉시블 인쇄회로 기판용 단자구조물
JPS55111151A (en) Integrated circuit device
DE3879021D1 (de) Elektrische sicherung und verfahren zu ihrer herstellung.
JPS577985A (en) Magnetoelectricity converting element and manufacture thereof
GB1428701A (en) Electrical circuit arrangements
JPS5752114A (en) Fine coil
GB1443028A (en) Microminiaturized electrical compoennts
KR890001172A (ko) 반도체 장치
JPS5792852A (en) Hybrid integrated circuit
JPS57181144A (en) Semiconductor device
JPS57147262A (en) Manufacture of semiconductor device
JPS5618448A (en) Composite electronic part
JPS575356A (en) Hybrid integrated circuit device
JPS551153A (en) Semiconductor fitting device
JPS5710951A (en) Semiconductor device
JPH0221253Y2 (index.php)
JPS6464298A (en) Hybrid integrated circuit
JPS5546561A (en) Method of fabricating hybrid integrated circuit
JPS55157236A (en) Semiconductor device
JPS57187955A (en) Sealing structure of semiconductor element
JPS5552231A (en) Semiconductor attaching device
KR970063590A (ko) 탭 테이프를 적용한 칩 스케일 패키지
GB1303650A (index.php)
JPS5669850A (en) Method for sealing semiconductor device
JPS58164130U (ja) スイツチ回路板