JPS57143847A - Air-tight sealed package - Google Patents

Air-tight sealed package

Info

Publication number
JPS57143847A
JPS57143847A JP56029072A JP2907281A JPS57143847A JP S57143847 A JPS57143847 A JP S57143847A JP 56029072 A JP56029072 A JP 56029072A JP 2907281 A JP2907281 A JP 2907281A JP S57143847 A JPS57143847 A JP S57143847A
Authority
JP
Japan
Prior art keywords
parts
welded
cover
gold plating
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56029072A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6146060B2 (enrdf_load_stackoverflow
Inventor
Tetsushi Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56029072A priority Critical patent/JPS57143847A/ja
Publication of JPS57143847A publication Critical patent/JPS57143847A/ja
Publication of JPS6146060B2 publication Critical patent/JPS6146060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
JP56029072A 1981-02-27 1981-02-27 Air-tight sealed package Granted JPS57143847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56029072A JPS57143847A (en) 1981-02-27 1981-02-27 Air-tight sealed package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56029072A JPS57143847A (en) 1981-02-27 1981-02-27 Air-tight sealed package

Publications (2)

Publication Number Publication Date
JPS57143847A true JPS57143847A (en) 1982-09-06
JPS6146060B2 JPS6146060B2 (enrdf_load_stackoverflow) 1986-10-11

Family

ID=12266145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56029072A Granted JPS57143847A (en) 1981-02-27 1981-02-27 Air-tight sealed package

Country Status (1)

Country Link
JP (1) JPS57143847A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130246U (ja) * 1984-07-27 1986-02-24 日本碍子株式会社 部分めつきセラミツクパツケ−ジ
JPS61238484A (ja) * 1985-04-12 1986-10-23 Fujitsu Ltd レ−ザ溶接方法
US6974635B1 (en) 1998-09-24 2005-12-13 Neomax Materials Co., Ltd. Package for electronic component, lid material for package lid, and production method for lid material
JP2014012284A (ja) * 2012-07-04 2014-01-23 Toyota Motor Corp 加熱方法及び接合方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130246U (ja) * 1984-07-27 1986-02-24 日本碍子株式会社 部分めつきセラミツクパツケ−ジ
JPS61238484A (ja) * 1985-04-12 1986-10-23 Fujitsu Ltd レ−ザ溶接方法
US6974635B1 (en) 1998-09-24 2005-12-13 Neomax Materials Co., Ltd. Package for electronic component, lid material for package lid, and production method for lid material
JP2014012284A (ja) * 2012-07-04 2014-01-23 Toyota Motor Corp 加熱方法及び接合方法

Also Published As

Publication number Publication date
JPS6146060B2 (enrdf_load_stackoverflow) 1986-10-11

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