JPS57139953A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57139953A
JPS57139953A JP56025823A JP2582381A JPS57139953A JP S57139953 A JPS57139953 A JP S57139953A JP 56025823 A JP56025823 A JP 56025823A JP 2582381 A JP2582381 A JP 2582381A JP S57139953 A JPS57139953 A JP S57139953A
Authority
JP
Japan
Prior art keywords
stem
leads
guide
film carrier
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56025823A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6221267B2 (https=
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56025823A priority Critical patent/JPS57139953A/ja
Publication of JPS57139953A publication Critical patent/JPS57139953A/ja
Publication of JPS6221267B2 publication Critical patent/JPS6221267B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP56025823A 1981-02-24 1981-02-24 Semiconductor device Granted JPS57139953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56025823A JPS57139953A (en) 1981-02-24 1981-02-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56025823A JPS57139953A (en) 1981-02-24 1981-02-24 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57139953A true JPS57139953A (en) 1982-08-30
JPS6221267B2 JPS6221267B2 (https=) 1987-05-12

Family

ID=12176575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56025823A Granted JPS57139953A (en) 1981-02-24 1981-02-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57139953A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189742A (ja) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd ピングリツドアレイ
JPH03293739A (ja) * 1990-04-12 1991-12-25 Toshiba Corp 半導体装置
JPH08330464A (ja) * 1995-05-31 1996-12-13 Nec Kyushu Ltd ピン・グリッド・アレイ構造ｌｓｉ
JPH09191025A (ja) * 1995-05-08 1997-07-22 Fujitsu Ltd Ｉｃ支持フィルムの位置決め方法とそれを用いたｉｃチップの試験方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62189742A (ja) * 1986-02-14 1987-08-19 Matsushita Electric Works Ltd ピングリツドアレイ
JPH03293739A (ja) * 1990-04-12 1991-12-25 Toshiba Corp 半導体装置
JPH09191025A (ja) * 1995-05-08 1997-07-22 Fujitsu Ltd Ｉｃ支持フィルムの位置決め方法とそれを用いたｉｃチップの試験方法
JPH08330464A (ja) * 1995-05-31 1996-12-13 Nec Kyushu Ltd ピン・グリッド・アレイ構造ｌｓｉ

Also Published As

Publication number Publication date
JPS6221267B2 (https=) 1987-05-12

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