JPS57138961A - Crossover formation for thermal head - Google Patents

Crossover formation for thermal head

Info

Publication number
JPS57138961A
JPS57138961A JP56024212A JP2421281A JPS57138961A JP S57138961 A JPS57138961 A JP S57138961A JP 56024212 A JP56024212 A JP 56024212A JP 2421281 A JP2421281 A JP 2421281A JP S57138961 A JPS57138961 A JP S57138961A
Authority
JP
Japan
Prior art keywords
thick film
paste
conductor
thermal head
film paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56024212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6129276B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Kiyoshi Sato
Minoru Terajima
Haruo Tanmachi
Toshiaki Naka
Tateo Kanno
Fumiaki Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56024212A priority Critical patent/JPS57138961A/ja
Priority to US06/351,284 priority patent/US4446355A/en
Priority to DE8282300916T priority patent/DE3270942D1/de
Priority to EP82300916A priority patent/EP0059102B1/en
Publication of JPS57138961A publication Critical patent/JPS57138961A/ja
Publication of JPS6129276B2 publication Critical patent/JPS6129276B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electronic Switches (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP56024212A 1981-02-23 1981-02-23 Crossover formation for thermal head Granted JPS57138961A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56024212A JPS57138961A (en) 1981-02-23 1981-02-23 Crossover formation for thermal head
US06/351,284 US4446355A (en) 1981-02-23 1982-02-22 Crossover construction of thermal-head and method of manufacturing same
DE8282300916T DE3270942D1 (en) 1981-02-23 1982-02-23 Crossover construction of thermal-head
EP82300916A EP0059102B1 (en) 1981-02-23 1982-02-23 Crossover construction of thermal-head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56024212A JPS57138961A (en) 1981-02-23 1981-02-23 Crossover formation for thermal head

Publications (2)

Publication Number Publication Date
JPS57138961A true JPS57138961A (en) 1982-08-27
JPS6129276B2 JPS6129276B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-05

Family

ID=12131984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56024212A Granted JPS57138961A (en) 1981-02-23 1981-02-23 Crossover formation for thermal head

Country Status (4)

Country Link
US (1) US4446355A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0059102B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS57138961A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3270942D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3300104C1 (de) * 1983-01-04 1983-12-15 F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach Thermodruckplatine fuer eine Thermodruckvorrichtung
JP2506634B2 (ja) * 1985-04-19 1996-06-12 松下電器産業株式会社 感熱記録ヘッド
US4809428A (en) * 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same
US4881087A (en) * 1988-03-02 1989-11-14 Dynamics Research Corporation Printhead structure and method of fabrication
JPH03268952A (ja) * 1990-03-19 1991-11-29 Toshiba Corp サーマルヘッド
KR100237679B1 (ko) * 1995-12-30 2000-01-15 윤종용 저항 차를 줄이는 팬 아웃부를 가지는 액정 표시 패널
US7304276B2 (en) * 2001-06-21 2007-12-04 Watlow Electric Manufacturing Company Thick film heater integrated with low temperature components and method of making the same
DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
DE102008032509A1 (de) * 2008-07-10 2010-01-14 Epcos Ag Heizungsvorrichtung und Verfahren zur Herstellung der Heizungsvorrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609294A (en) * 1969-10-10 1971-09-28 Ncr Co Thermal printing head with thin film printing elements
US3736406A (en) * 1972-06-21 1973-05-29 Rca Corp Thermographic print head and method of making same
US4031272A (en) * 1975-05-09 1977-06-21 Bell Telephone Laboratories, Incorporated Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof
US4017712A (en) * 1975-12-08 1977-04-12 Northern Electric Co Thermal printing device
JPS53114072A (en) * 1977-03-17 1978-10-05 Oki Electric Ind Co Ltd Multilayer circuit
DD130222A1 (de) * 1977-04-01 1978-03-15 Johann Kleineberg Thermodruckkopf sowie verfahren zu seiner herstellung
US4099046A (en) * 1977-04-11 1978-07-04 Northern Telecom Limited Thermal printing device
US4241103A (en) * 1977-05-31 1980-12-23 Nippon Electric Co., Ltd. Method of manufacturing an integrated thermal printing head
JPS5953875B2 (ja) * 1978-06-14 1984-12-27 株式会社東芝 感熱記録ヘツド

Also Published As

Publication number Publication date
JPS6129276B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-07-05
EP0059102B1 (en) 1986-05-07
DE3270942D1 (en) 1986-06-12
US4446355A (en) 1984-05-01
EP0059102A2 (en) 1982-09-01
EP0059102A3 (en) 1983-09-14

Similar Documents

Publication Publication Date Title
DE3587481D1 (de) Schaltungssubstrat mit hoher waermeleitfaehigkeit.
SE7707747L (sv) Vermeelement
JPS5477081A (en) Semiconductor device and production of the same
JPS57138961A (en) Crossover formation for thermal head
GB2154373B (en) Improvements in chip resistors
EP0272678A3 (en) Conductive pattern producing method and its applications
ATE166520T1 (de) Verbesserungen an dickschichtelementen
KR830006781A (ko) 후막(厚膜)저항회로
JPS5771160A (en) Manufacture of thick film printed circuit substrate
CA1232085A (en) Electrically conductive materials for devices
JPS5736676A (ja) Saamaruhetsudo
JPS57126182A (en) Superconductor element
JPS56157053A (en) Manufacture of thick film hybrid ic plate
JPS5565576A (en) Thermal head
JPS54101399A (en) Moisture sensitive element
JPS578175A (en) Multilayer interconnection structure for crossover and manufacture thereof
JPS5680066A (en) Multistylus electrode connecting substrate
JPS5773959A (en) Manufacture of thick film hybrid integrated circuit board
JPS55111152A (en) Method of manufacturing multilayer thin film circuit board
JPS54153288A (en) Cable conductor
JPS56104241A (en) Gas sensing element
JPS5492265A (en) Production of thermal head
JPS6453593A (en) Thick film hybrid integrated circuit
JPS5764579A (en) Thermal printing head
JPS6045095A (ja) 厚膜多層基板の製造方法