JPS571359B2 - - Google Patents

Info

Publication number
JPS571359B2
JPS571359B2 JP13829775A JP13829775A JPS571359B2 JP S571359 B2 JPS571359 B2 JP S571359B2 JP 13829775 A JP13829775 A JP 13829775A JP 13829775 A JP13829775 A JP 13829775A JP S571359 B2 JPS571359 B2 JP S571359B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13829775A
Other versions
JPS5175295A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5175295A publication Critical patent/JPS5175295A/ja
Publication of JPS571359B2 publication Critical patent/JPS571359B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/704—Beam dispersers, e.g. beam wells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/26—Perforating by non-mechanical means, e.g. by fluid jet
    • B26F1/31—Perforating by non-mechanical means, e.g. by fluid jet by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/074—Features related to the fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Laser Beam Processing (AREA)
JP13829775A 1974-12-16 1975-11-19 Expired JPS571359B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53336274A 1974-12-16 1974-12-16

Publications (2)

Publication Number Publication Date
JPS5175295A JPS5175295A (ja) 1976-06-29
JPS571359B2 true JPS571359B2 (ja) 1982-01-11

Family

ID=24125634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13829775A Expired JPS571359B2 (ja) 1974-12-16 1975-11-19

Country Status (6)

Country Link
US (1) US4115683A (ja)
JP (1) JPS571359B2 (ja)
DE (1) DE2554367C2 (ja)
FR (1) FR2309317A1 (ja)
GB (1) GB1474505A (ja)
IT (1) IT1050020B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412361Y2 (ja) * 1988-05-11 1992-03-25
JPH0412363Y2 (ja) * 1988-05-11 1992-03-25

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2740755A1 (de) * 1976-10-07 1978-04-13 Lasag Ag Verfahren zum abtragen von material von einem metallischen werkstueck, insbesondere zum bohren, mittels eines fokussierten laserstrahlimpulses
US4410785A (en) * 1978-06-07 1983-10-18 Philip Morris Incorporated Method and apparatus for perforation of sheet material by laser
US4439663A (en) * 1978-08-10 1984-03-27 Philip Morris Incorporated Method and system for laser perforation of sheet material
US4297559A (en) * 1979-05-10 1981-10-27 Olin Corporation Apparatus for controlled perforation of moving webs with fixed focus laser beam
US4404452A (en) * 1979-06-08 1983-09-13 Philip Morris Incorporated Optical perforating apparatus and system
DE3018759C2 (de) * 1980-05-16 1982-05-06 Held, Kurt, 7218 Trossingen Verfahren zum Profilieren von Metallbändern
US4375025A (en) * 1980-06-19 1983-02-22 Automated Industrial Systems, Inc. Laser strip marker
GB8330178D0 (en) * 1983-11-11 1983-12-21 Molins Plc Cigarette manufacture
US4650619A (en) * 1983-12-29 1987-03-17 Toshiba Ceramics Co., Ltd. Method of machining a ceramic member
FR2558976A1 (fr) * 1984-01-27 1985-08-02 Digitomatic Machine a deplacements relatifs selon deux axes pour faconner ou reperer un trace sur un produit en feuille
DE3433961A1 (de) * 1984-05-18 1985-11-21 M.A.N. Maschinenfabrik Augsburg-Nürnberg AG, 8000 München Verfahren zum unterstuetzen eines eisbrechvorganges
US5168454A (en) * 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
US6163010A (en) * 1996-10-25 2000-12-19 E. I. Du Pont De Nemours And Company Method and apparatus for laser cutting materials
US5911890A (en) * 1997-02-25 1999-06-15 Lsp Technologies, Inc. Oblique angle laser shock processing
JP2000165017A (ja) * 1998-11-25 2000-06-16 Taiyo Yuden Co Ltd セラミックグリーンシートの加工方法及びその装置
US6469275B2 (en) 1999-01-20 2002-10-22 Lsp Technologies, Inc Oblique angle laser shock processing
US6515256B1 (en) * 2000-04-13 2003-02-04 Vincent P. Battaglia Process for laser machining continuous metal strip
JP4313620B2 (ja) * 2003-06-30 2009-08-12 株式会社日立ハイテクインスツルメンツ 電子部品供給装置を備えた電子部品装着装置
JP2006007250A (ja) * 2004-06-23 2006-01-12 Disco Abrasive Syst Ltd 被加工物保持装置
JP4473715B2 (ja) * 2004-11-29 2010-06-02 富士通株式会社 積層体切断方法及び積層体
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7789738B2 (en) * 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
ITBO20060586A1 (it) * 2006-08-03 2006-11-02 El En Spa Dispositivo per il taglio laser di un nastro continuo.
US20080064310A1 (en) * 2006-09-08 2008-03-13 Chung-Chih Feng Polishing pad having hollow fibers and the method for making the same
US20090252876A1 (en) * 2007-05-07 2009-10-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
GB2459154B (en) * 2008-04-17 2011-12-07 M Solv Ltd Cylindrical laser process drum
KR100961469B1 (ko) * 2008-05-06 2010-06-08 세메스 주식회사 기판 세정 장치 및 그 방법
GB2467296B (en) * 2009-01-22 2012-06-20 Cav Advanced Technologies Ltd Apparatus and method for perforating material
US10008403B2 (en) 2009-10-19 2018-06-26 M-Solv Limited Apparatus for processing continuous lengths of flexible foil
TWI462164B (zh) * 2009-11-13 2014-11-21 Inotera Memories Inc 清潔晶圓載盤的方法
NL2005686C2 (en) * 2010-05-17 2011-11-21 Bruijne Delden Holding B V De Transport device with endless conveyor belt.
DE102011103481B4 (de) * 2011-06-03 2017-08-17 Leibniz-Institut für Oberflächenmodifizierung e.V. Selektives Abtragen dünner Schichten mittels gepulster Laserstrahlung zur Dünnschichtstrukturierung
CN104203544B (zh) * 2012-05-16 2018-05-08 花王株式会社 片熔接体的制造方法
JP6064228B2 (ja) * 2013-05-24 2017-01-25 パナソニックＩｐマネジメント株式会社 レーザ切断装置およびレーザ切断方法
JP6161029B2 (ja) 2013-06-28 2017-07-12 花王株式会社 パンツ型着用物品及びその製造方法
JP5766252B2 (ja) 2013-11-01 2015-08-19 花王株式会社 パンツ型着用物品及びその製造方法
JP6252301B2 (ja) * 2014-03-28 2017-12-27 住友ベークライト株式会社 樹脂フィルム加工装置
CN106363817B (zh) * 2015-07-23 2018-04-20 东莞市冬驭新材料股份有限公司 一种导热石墨片废料去除装置及其去除方法
CN106553237B (zh) * 2015-09-29 2019-09-27 中国科学院西安光学精密机械研究所 一种薄膜冲孔机及冲孔方法
GB2554849B (en) * 2016-06-30 2021-05-19 Blackman & White Ltd Laser cutters and laser cutting systems
TWI613028B (zh) * 2016-09-09 2018-02-01 財團法人工業技術研究院 雷射加工裝置及雷射加工排屑裝置
CN109661290A (zh) * 2016-09-23 2019-04-19 塔塔钢铁荷兰科技有限责任公司 用于运动钢带的液体辅助激光纹理化的方法和装置
CN108515573B (zh) * 2018-03-30 2020-04-10 遵义锦鸿富科技发展有限公司 塑料泡沫打孔装置
CN110076466B (zh) * 2019-05-15 2021-05-14 科逻技术(深圳)有限公司 一种印制线路板上盲孔的加工装置及加工工艺
WO2021080475A1 (en) * 2019-10-22 2021-04-29 Essity Hygiene And Health Aktiebolag A method for simultaneously cutting and forming side seams in a precursor web of interconnected pant-type garments

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3371404A (en) * 1957-06-27 1968-03-05 Jerome H. Lemelson Method of simultaneously cladding and deforming material by intense pressure
US3226527A (en) * 1963-10-23 1965-12-28 William H Harding Apparatus for perforating sheet material
US3742182A (en) * 1971-12-27 1973-06-26 Coherent Radiation Method for scanning mask forming holes with a laser beam

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0412361Y2 (ja) * 1988-05-11 1992-03-25
JPH0412363Y2 (ja) * 1988-05-11 1992-03-25

Also Published As

Publication number Publication date
US4115683A (en) 1978-09-19
IT1050020B (it) 1981-03-10
GB1474505A (ja) 1977-05-25
DE2554367C2 (de) 1983-03-31
FR2309317A1 (fr) 1976-11-26
DE2554367A1 (de) 1976-06-24
JPS5175295A (ja) 1976-06-29
FR2309317B1 (ja) 1978-04-07

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