JPS57128947A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57128947A JPS57128947A JP56015467A JP1546781A JPS57128947A JP S57128947 A JPS57128947 A JP S57128947A JP 56015467 A JP56015467 A JP 56015467A JP 1546781 A JP1546781 A JP 1546781A JP S57128947 A JPS57128947 A JP S57128947A
- Authority
- JP
- Japan
- Prior art keywords
- metal coating
- resin
- sealed
- flash
- boundary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/457—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56015467A JPS57128947A (en) | 1981-02-04 | 1981-02-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56015467A JPS57128947A (en) | 1981-02-04 | 1981-02-04 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57128947A true JPS57128947A (en) | 1982-08-10 |
| JPS6217874B2 JPS6217874B2 (cg-RX-API-DMAC10.html) | 1987-04-20 |
Family
ID=11889599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56015467A Granted JPS57128947A (en) | 1981-02-04 | 1981-02-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128947A (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117166U (ja) * | 1983-01-27 | 1984-08-07 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
| CN105702656A (zh) * | 2014-12-10 | 2016-06-22 | 意法半导体私人公司 | 在引线互连点上具有镀层的集成电路器件及其形成方法 |
-
1981
- 1981-02-04 JP JP56015467A patent/JPS57128947A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117166U (ja) * | 1983-01-27 | 1984-08-07 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
| CN105702656A (zh) * | 2014-12-10 | 2016-06-22 | 意法半导体私人公司 | 在引线互连点上具有镀层的集成电路器件及其形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6217874B2 (cg-RX-API-DMAC10.html) | 1987-04-20 |
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