JPS57114358A - Blade and its manufacture - Google Patents

Blade and its manufacture

Info

Publication number
JPS57114358A
JPS57114358A JP56000137A JP13781A JPS57114358A JP S57114358 A JPS57114358 A JP S57114358A JP 56000137 A JP56000137 A JP 56000137A JP 13781 A JP13781 A JP 13781A JP S57114358 A JPS57114358 A JP S57114358A
Authority
JP
Japan
Prior art keywords
blade
peripheral part
face
work
side faces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56000137A
Other languages
Japanese (ja)
Inventor
Masaaki Kuniyoshi
Shigeru Fujimoto
Takashi Tsumagari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56000137A priority Critical patent/JPS57114358A/en
Publication of JPS57114358A publication Critical patent/JPS57114358A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To prevent generation of chippings in the side face of a blade when a semiconductor wafer is treated by groove cutting, by forming both side faces of the blade to hollowed surfaces and decreasing thickness of the blade in accordance with its position from the peripheral part to the internal peripheral part. CONSTITUTION:At groove cutting work of a semiconductor wafer, such a blade 11 is used that its thickness is smaller in accordance with a position of the blade from the peripheral part to the internal peripheral part of an annularly formed ground part 13 further both side faces 14, 15 of the above described ground part 13 are formed to hollowed surfaces respectively. This blade 11 is manufactured in such a manner that one of the faces of a blade base material with both side faces in a plane is adhesively fixed to a base plate 31 to process lapping work on a lapping machine 33 consisting of a convex spherical surface with radius R, thus perform lapping work of one face of the above described blade base material, and then lapping work is similarly performed to complete the other face.
JP56000137A 1981-01-06 1981-01-06 Blade and its manufacture Pending JPS57114358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000137A JPS57114358A (en) 1981-01-06 1981-01-06 Blade and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000137A JPS57114358A (en) 1981-01-06 1981-01-06 Blade and its manufacture

Publications (1)

Publication Number Publication Date
JPS57114358A true JPS57114358A (en) 1982-07-16

Family

ID=11465636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000137A Pending JPS57114358A (en) 1981-01-06 1981-01-06 Blade and its manufacture

Country Status (1)

Country Link
JP (1) JPS57114358A (en)

Similar Documents

Publication Publication Date Title
JPS56107869A (en) Grinding process of flat sheet by cutting and grinding wheel
EP0148448A3 (en) Etching method
JPS57114358A (en) Blade and its manufacture
FR2403827A1 (en) Crushing tool with four mounting positions - has parallelepiped shape consisting of three materials with different properties sandwiched together
JPS6457629A (en) Semiconductor device
JPS5613728A (en) Grinding method for semiconductor wafer
JPS51111993A (en) Apparatus for fabricating thin work as semiconductor or the like
JPS5232651A (en) Twist motor oscillator
JPS56101674A (en) Floating head slider
JPS6411754A (en) Manufacture for mirror surfaced wafer
JPS5416792A (en) Cutting apparatus
EP0320090A3 (en) Shaping silicon semiconductor wafers
JPS57182946A (en) Cathode-ray tube and its manufacture
JPS5343295A (en) Internal surface grinder
JPS52156551A (en) Semiconductor wafer breaking method
JPS5341891A (en) Electrolytic buffing and processing method
JPS56130944A (en) Diamond cutter
JPS5420494A (en) Polisher for surface processing
JPS5741101A (en) Processing of flange for vacuum
JPS55120974A (en) Lapping device for ceramic substance
Miller Designing ECD Tooling
JPS55166932A (en) Pellet positioning mechanism
JPS569161A (en) Grinding method for ceramic or crystallized substrate
JPS5667933A (en) Scribe method of semiconductor wafer
JPS57109335A (en) Positional matching method between mask substrate and wafer