JPS57104220A - Wafer fixing apparatus - Google Patents

Wafer fixing apparatus

Info

Publication number
JPS57104220A
JPS57104220A JP18159780A JP18159780A JPS57104220A JP S57104220 A JPS57104220 A JP S57104220A JP 18159780 A JP18159780 A JP 18159780A JP 18159780 A JP18159780 A JP 18159780A JP S57104220 A JPS57104220 A JP S57104220A
Authority
JP
Japan
Prior art keywords
wafer
sample table
thin film
addition
grooved part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18159780A
Other languages
Japanese (ja)
Inventor
Sadao Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP18159780A priority Critical patent/JPS57104220A/en
Publication of JPS57104220A publication Critical patent/JPS57104220A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To fix a wafer which is to be subjected to a electron beam exposure on a sample table without any curvature and to contrive to perform automatically pre-alignment of the wafer when it is fixed. CONSTITUTION:In addition to fixing of the first and second thin film 11, 12 individually at the center and alog the circumference of a wafer, the first grooved part 21 which has a nearly same shape as the first thin film 11 and a little smaller diameter is provided on a surface of a sample table 20. Furthermore the second grooved part 22a, 22b is provided around the circumferences, in addition to swinging the sample table 20, it is connected to a vacuum source, and after relative position setting between the first thin film 11 and the first grooved part 21, the wafer 10 is pressed to the sample table 20 by means of vacuum suction. Consequently the circumference of the wafer 10 is also attached to the sample table 20, and in addition to automatic pre-alignment through correction on a curvature of the wafer 10 by this action, it is fixed firmly on the sample table 20.
JP18159780A 1980-12-22 1980-12-22 Wafer fixing apparatus Pending JPS57104220A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18159780A JPS57104220A (en) 1980-12-22 1980-12-22 Wafer fixing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18159780A JPS57104220A (en) 1980-12-22 1980-12-22 Wafer fixing apparatus

Publications (1)

Publication Number Publication Date
JPS57104220A true JPS57104220A (en) 1982-06-29

Family

ID=16103586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18159780A Pending JPS57104220A (en) 1980-12-22 1980-12-22 Wafer fixing apparatus

Country Status (1)

Country Link
JP (1) JPS57104220A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634043A (en) * 1984-09-20 1987-01-06 At&T Technologies, Inc. Engaging second articles to engaged first articles
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634043A (en) * 1984-09-20 1987-01-06 At&T Technologies, Inc. Engaging second articles to engaged first articles
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5782152A (en) * 1995-08-15 1998-07-21 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5800661A (en) * 1995-08-15 1998-09-01 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5870937A (en) * 1995-08-15 1999-02-16 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
US5906363A (en) * 1995-08-15 1999-05-25 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials

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