JPS57104220A - Wafer fixing apparatus - Google Patents
Wafer fixing apparatusInfo
- Publication number
- JPS57104220A JPS57104220A JP18159780A JP18159780A JPS57104220A JP S57104220 A JPS57104220 A JP S57104220A JP 18159780 A JP18159780 A JP 18159780A JP 18159780 A JP18159780 A JP 18159780A JP S57104220 A JPS57104220 A JP S57104220A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- sample table
- thin film
- addition
- grooved part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 abstract 3
- 238000010894 electron beam technology Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electron Beam Exposure (AREA)
Abstract
PURPOSE:To fix a wafer which is to be subjected to a electron beam exposure on a sample table without any curvature and to contrive to perform automatically pre-alignment of the wafer when it is fixed. CONSTITUTION:In addition to fixing of the first and second thin film 11, 12 individually at the center and alog the circumference of a wafer, the first grooved part 21 which has a nearly same shape as the first thin film 11 and a little smaller diameter is provided on a surface of a sample table 20. Furthermore the second grooved part 22a, 22b is provided around the circumferences, in addition to swinging the sample table 20, it is connected to a vacuum source, and after relative position setting between the first thin film 11 and the first grooved part 21, the wafer 10 is pressed to the sample table 20 by means of vacuum suction. Consequently the circumference of the wafer 10 is also attached to the sample table 20, and in addition to automatic pre-alignment through correction on a curvature of the wafer 10 by this action, it is fixed firmly on the sample table 20.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18159780A JPS57104220A (en) | 1980-12-22 | 1980-12-22 | Wafer fixing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18159780A JPS57104220A (en) | 1980-12-22 | 1980-12-22 | Wafer fixing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57104220A true JPS57104220A (en) | 1982-06-29 |
Family
ID=16103586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18159780A Pending JPS57104220A (en) | 1980-12-22 | 1980-12-22 | Wafer fixing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57104220A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634043A (en) * | 1984-09-20 | 1987-01-06 | At&T Technologies, Inc. | Engaging second articles to engaged first articles |
US5660380A (en) * | 1995-08-15 | 1997-08-26 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
-
1980
- 1980-12-22 JP JP18159780A patent/JPS57104220A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4634043A (en) * | 1984-09-20 | 1987-01-06 | At&T Technologies, Inc. | Engaging second articles to engaged first articles |
US5660380A (en) * | 1995-08-15 | 1997-08-26 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
US5782152A (en) * | 1995-08-15 | 1998-07-21 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
US5800661A (en) * | 1995-08-15 | 1998-09-01 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
US5870937A (en) * | 1995-08-15 | 1999-02-16 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
US5906363A (en) * | 1995-08-15 | 1999-05-25 | W. L. Gore & Associates, Inc. | Vacuum fixture and method for dimensioning and manipulating materials |
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