JPS57103342A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57103342A JPS57103342A JP17605781A JP17605781A JPS57103342A JP S57103342 A JPS57103342 A JP S57103342A JP 17605781 A JP17605781 A JP 17605781A JP 17605781 A JP17605781 A JP 17605781A JP S57103342 A JPS57103342 A JP S57103342A
- Authority
- JP
- Japan
- Prior art keywords
- whisker
- lead frame
- semiconductor device
- leads
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229910018731 Sn—Au Inorganic materials 0.000 abstract 3
- 229910001325 element alloy Inorganic materials 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 229910052763 palladium Inorganic materials 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17605781A JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17605781A JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4595474A Division JPS5731298B2 (enrdf_load_stackoverflow) | 1974-04-25 | 1974-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57103342A true JPS57103342A (en) | 1982-06-26 |
| JPS6211784B2 JPS6211784B2 (enrdf_load_stackoverflow) | 1987-03-14 |
Family
ID=16006959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17605781A Granted JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57103342A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396050U (enrdf_load_stackoverflow) * | 1990-01-23 | 1991-10-01 | ||
| JP2000223634A (ja) * | 1999-01-28 | 2000-08-11 | Hitachi Ltd | 半導体装置 |
| US6774466B1 (en) * | 1999-01-28 | 2004-08-10 | Renesas Technology Corp. | Semiconductor device |
| JP2006269903A (ja) * | 2005-03-25 | 2006-10-05 | Shinko Electric Ind Co Ltd | 半導体装置用リードフレーム |
| WO2011001737A1 (ja) * | 2009-06-29 | 2011-01-06 | オーエム産業株式会社 | 電気部品の製造方法及び電気部品 |
-
1981
- 1981-11-02 JP JP17605781A patent/JPS57103342A/ja active Granted
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396050U (enrdf_load_stackoverflow) * | 1990-01-23 | 1991-10-01 | ||
| US8455986B2 (en) | 1999-01-28 | 2013-06-04 | Renesas Electronics Corporation | Mosfet package |
| JP2000223634A (ja) * | 1999-01-28 | 2000-08-11 | Hitachi Ltd | 半導体装置 |
| US7332757B2 (en) | 1999-01-28 | 2008-02-19 | Renesas Technology Corp. | MOSFET package |
| US7342267B2 (en) | 1999-01-28 | 2008-03-11 | Renesas Technology Corp. | MOSFET package |
| US7394146B2 (en) | 1999-01-28 | 2008-07-01 | Renesas Tehcnology Corp. | MOSFET package |
| US6774466B1 (en) * | 1999-01-28 | 2004-08-10 | Renesas Technology Corp. | Semiconductor device |
| US7985991B2 (en) | 1999-01-28 | 2011-07-26 | Renesas Electronics Corporation | MOSFET package |
| US7400002B2 (en) | 1999-01-28 | 2008-07-15 | Renesas Technology Corp. | MOSFET package |
| US8183607B2 (en) | 1999-01-28 | 2012-05-22 | Renesas Electronics Corporation | Semiconductor device |
| US8816411B2 (en) | 1999-01-28 | 2014-08-26 | Renesas Electronics Corporation | Mosfet package |
| JP2006269903A (ja) * | 2005-03-25 | 2006-10-05 | Shinko Electric Ind Co Ltd | 半導体装置用リードフレーム |
| CN102575369A (zh) * | 2009-06-29 | 2012-07-11 | Om产业股份有限公司 | 电气元件的制造方法和电气元件 |
| WO2011001737A1 (ja) * | 2009-06-29 | 2011-01-06 | オーエム産業株式会社 | 電気部品の製造方法及び電気部品 |
| JP5679216B2 (ja) * | 2009-06-29 | 2015-03-04 | オーエム産業株式会社 | 電気部品の製造方法 |
| CN102575369B (zh) * | 2009-06-29 | 2015-08-05 | Om产业股份有限公司 | 电气元件的制造方法和电气元件 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211784B2 (enrdf_load_stackoverflow) | 1987-03-14 |
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