JPS57100743A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS57100743A
JPS57100743A JP55177358A JP17735880A JPS57100743A JP S57100743 A JPS57100743 A JP S57100743A JP 55177358 A JP55177358 A JP 55177358A JP 17735880 A JP17735880 A JP 17735880A JP S57100743 A JPS57100743 A JP S57100743A
Authority
JP
Japan
Prior art keywords
region
emitter
latch
potential
vcc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55177358A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6331943B2 (enrdf_load_stackoverflow
Inventor
Michihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55177358A priority Critical patent/JPS57100743A/ja
Publication of JPS57100743A publication Critical patent/JPS57100743A/ja
Publication of JPS6331943B2 publication Critical patent/JPS6331943B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/761—PN junctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP55177358A 1980-12-16 1980-12-16 Semiconductor integrated circuit device Granted JPS57100743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55177358A JPS57100743A (en) 1980-12-16 1980-12-16 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55177358A JPS57100743A (en) 1980-12-16 1980-12-16 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS57100743A true JPS57100743A (en) 1982-06-23
JPS6331943B2 JPS6331943B2 (enrdf_load_stackoverflow) 1988-06-27

Family

ID=16029562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55177358A Granted JPS57100743A (en) 1980-12-16 1980-12-16 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57100743A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191347A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
JPS59191346A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
JPS59191348A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
US5278434A (en) * 1991-05-30 1994-01-11 Mitsubishi Denki Kabushiki Kaisha Pressure engagement structure for a full press-pack type semiconductor device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245158A (ja) * 1988-08-06 1990-02-15 Brother Ind Ltd ドットプリンタヘッドの溶接方法
JPH0245160A (ja) * 1988-08-05 1990-02-15 Brother Ind Ltd ドットプリンタヘッドの組立方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151572U (enrdf_load_stackoverflow) * 1975-05-27 1976-12-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151572U (enrdf_load_stackoverflow) * 1975-05-27 1976-12-03

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191347A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
JPS59191346A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
JPS59191348A (ja) * 1983-04-14 1984-10-30 Sanyo Electric Co Ltd 半導体集積回路
US5278434A (en) * 1991-05-30 1994-01-11 Mitsubishi Denki Kabushiki Kaisha Pressure engagement structure for a full press-pack type semiconductor device

Also Published As

Publication number Publication date
JPS6331943B2 (enrdf_load_stackoverflow) 1988-06-27

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