JPS5693365A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5693365A JPS5693365A JP16961179A JP16961179A JPS5693365A JP S5693365 A JPS5693365 A JP S5693365A JP 16961179 A JP16961179 A JP 16961179A JP 16961179 A JP16961179 A JP 16961179A JP S5693365 A JPS5693365 A JP S5693365A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- chip
- type
- circuit
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To effectively prevent an electrostatic puncture of an internal element by a method wherein a low resistance layer comprising an N type layer is mounted on an IC chip itself on which the internal element is formed, and used as an electrostatic puncture prevention circuit. CONSTITUTION:The electrostatic puncture prevention circuit 3 is formed situated within the same chip between an input/output circuit 2 constituting the IC chip and an input/output terminal 1. That is, an N type layer is grown on a P type semiconductor substrate provided with an N type region to made island-shape, and two wirings Pa and Pb are formed in crossing by a cross-under method through an SiO2 protective film 5 in the section where the N type low resistance layer made the island-shape is used as the electrostatic puncture prevention region. Namely, a wiring pattern Pd on one side is located on the chip and the wiring pattern Pb formed around the pattern Pd is interrupted at ends Pb1 and Pb2 respectively and arranged passed under the pattern Pb. Thus, the pattern Pa is conneted to the terminal 1 and the pattern Pb to an emitter terminal Te of a circuit 2, respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16961179A JPS5693365A (en) | 1979-12-26 | 1979-12-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16961179A JPS5693365A (en) | 1979-12-26 | 1979-12-26 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5693365A true JPS5693365A (en) | 1981-07-28 |
Family
ID=15889698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16961179A Pending JPS5693365A (en) | 1979-12-26 | 1979-12-26 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5693365A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07202224A (en) * | 1993-12-28 | 1995-08-04 | Nec Corp | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5221779A (en) * | 1975-08-13 | 1977-02-18 | Toshiba Corp | Bipolar-type semidonductor integrating circuit unit |
-
1979
- 1979-12-26 JP JP16961179A patent/JPS5693365A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5221779A (en) * | 1975-08-13 | 1977-02-18 | Toshiba Corp | Bipolar-type semidonductor integrating circuit unit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07202224A (en) * | 1993-12-28 | 1995-08-04 | Nec Corp | Semiconductor device |
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