JPS5693335A - Heat shielding of abnormally operating bonding device for manufacture of semiconductor device - Google Patents

Heat shielding of abnormally operating bonding device for manufacture of semiconductor device

Info

Publication number
JPS5693335A
JPS5693335A JP16916879A JP16916879A JPS5693335A JP S5693335 A JPS5693335 A JP S5693335A JP 16916879 A JP16916879 A JP 16916879A JP 16916879 A JP16916879 A JP 16916879A JP S5693335 A JPS5693335 A JP S5693335A
Authority
JP
Japan
Prior art keywords
block
heater block
heater
semiconductor device
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16916879A
Other languages
Japanese (ja)
Other versions
JPS5741822B2 (en
Inventor
Akihiro Kubota
Shigeru Sato
Masao Kobayashi
Shiyouichi Ogata
Kyohei Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16916879A priority Critical patent/JPS5693335A/en
Publication of JPS5693335A publication Critical patent/JPS5693335A/en
Publication of JPS5741822B2 publication Critical patent/JPS5741822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent the generation of an inferiorly manufactured semiconductor device by a method wherein when a heater block operates abnormally, the block is made to come down and an inert as is made to flow in the gap between the block and the manufacturing parts to shield heat. CONSTITUTION:The heater block 3 having a heater 4 performs reciprocating motion upward and downward as shown with an arrow mark A at the lower side of supporting parts 2 holding a lead frame 1. N2 gas is supplied from a gas cylinder 12 through an electromagnetic valve 11 to be blown up from a pipe 5 in the direction of an arrow mark B and passes through a gap between the lead frame 1 and the heater block 3. When the heater block 3 operates abnormally, after the block 3 is locked at the descended position, both are thermally shielded by the gas. By this constitution, the thermal effect from the heater block on the semiconductor package is reduced, and the quality and the characteristic are not deteriorated.
JP16916879A 1979-12-27 1979-12-27 Heat shielding of abnormally operating bonding device for manufacture of semiconductor device Granted JPS5693335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16916879A JPS5693335A (en) 1979-12-27 1979-12-27 Heat shielding of abnormally operating bonding device for manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16916879A JPS5693335A (en) 1979-12-27 1979-12-27 Heat shielding of abnormally operating bonding device for manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5693335A true JPS5693335A (en) 1981-07-28
JPS5741822B2 JPS5741822B2 (en) 1982-09-04

Family

ID=15881517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16916879A Granted JPS5693335A (en) 1979-12-27 1979-12-27 Heat shielding of abnormally operating bonding device for manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5693335A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921284A (en) * 1982-07-23 1984-02-03 Hitachi Ltd Control device for pwm inverter
JPS61148827A (en) * 1984-12-24 1986-07-07 Toshiba Corp Wire bonding method
JPS63118233U (en) * 1987-01-23 1988-07-30
JPH03102842A (en) * 1989-09-14 1991-04-30 Nec Corp Semiconductor wire bonding device
JP2011249806A (en) * 2010-05-25 2011-12-08 Samsung Electro-Mechanics Co Ltd Wire bonding apparatus and wire bonding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921284A (en) * 1982-07-23 1984-02-03 Hitachi Ltd Control device for pwm inverter
JPS61148827A (en) * 1984-12-24 1986-07-07 Toshiba Corp Wire bonding method
JPS63118233U (en) * 1987-01-23 1988-07-30
JPH03102842A (en) * 1989-09-14 1991-04-30 Nec Corp Semiconductor wire bonding device
JP2011249806A (en) * 2010-05-25 2011-12-08 Samsung Electro-Mechanics Co Ltd Wire bonding apparatus and wire bonding method

Also Published As

Publication number Publication date
JPS5741822B2 (en) 1982-09-04

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