JPS63118233U - - Google Patents
Info
- Publication number
- JPS63118233U JPS63118233U JP884187U JP884187U JPS63118233U JP S63118233 U JPS63118233 U JP S63118233U JP 884187 U JP884187 U JP 884187U JP 884187 U JP884187 U JP 884187U JP S63118233 U JPS63118233 U JP S63118233U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stem
- heater block
- die bonding
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims 1
- 239000000112 cooling gas Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
Description
第１図は本考案の一実施例を説明するための断
面図、第２図は本考案の他の実施例を説明するた
めの断面図である。
１……ヒータブロツク、２……駆動装置、３，
８……基板クランプ、４，９……半導体チツプク
ランプ、５……ブロー装置、６……基板、７……
半導体チツプ。
FIG. 1 is a cross-sectional view for explaining one embodiment of the present invention, and FIG. 2 is a cross-sectional view for explaining another embodiment of the present invention. 1... Heater block, 2... Drive device, 3,
8...Substrate clamp, 4,9...Semiconductor chip clamp, 5...Blow device, 6...Substrate, 7...
semiconductor chip.
Claims (1)
ツク上で基板、ステムなどにダイボンデイングす
る装置において、前記加熱により一たん前記基板
、ステムなどにダイボンデイングされた半導体チ
ツプ、部品などを素早く冷却するために、少くと
も前記ダイボンデイング部分に冷却用の気体を吹
きつける装置と、前記ヒータブロツクと基板、ス
テムなどとの間に空気層を作るために、前記基板
、ステムなどとヒータブロツクとの間を引離す駆
動装置とを備えていることを特徴とするダイボン
デイング装置。 In an apparatus for die bonding semiconductor chips, components, etc. to a substrate, stem, etc. on a heated heater block, in order to quickly cool down the semiconductor chips, components, etc. once die bonded to the substrate, stem, etc. by the heating, A device for blowing cooling gas onto at least the die bonding portion, and separating the substrate, stem, etc. and the heater block in order to create an air layer between the heater block and the substrate, stem, etc. A die bonding device comprising a drive device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884187U JPS63118233U (en) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884187U JPS63118233U (en) | 1987-01-23 | 1987-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118233U true JPS63118233U (en) | 1988-07-30 |
Family
ID=30793597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP884187U Pending JPS63118233U (en) | 1987-01-23 | 1987-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118233U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5693335A (en) * | 1979-12-27 | 1981-07-28 | Fujitsu Ltd | Heat shielding of abnormally operating bonding device for manufacture of semiconductor device |
| JPS56110243A (en) * | 1980-02-04 | 1981-09-01 | Toshiba Corp | Autobonder heater stage |
| JPS60100440A (en) * | 1984-10-04 | 1985-06-04 | Fuji Electric Co Ltd | Soldering method for semiconductor film |
-
1987
- 1987-01-23 JP JP884187U patent/JPS63118233U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5693335A (en) * | 1979-12-27 | 1981-07-28 | Fujitsu Ltd | Heat shielding of abnormally operating bonding device for manufacture of semiconductor device |
| JPS56110243A (en) * | 1980-02-04 | 1981-09-01 | Toshiba Corp | Autobonder heater stage |
| JPS60100440A (en) * | 1984-10-04 | 1985-06-04 | Fuji Electric Co Ltd | Soldering method for semiconductor film |