JPH0292943U - - Google Patents

Info

Publication number
JPH0292943U
JPH0292943U JP140989U JP140989U JPH0292943U JP H0292943 U JPH0292943 U JP H0292943U JP 140989 U JP140989 U JP 140989U JP 140989 U JP140989 U JP 140989U JP H0292943 U JPH0292943 U JP H0292943U
Authority
JP
Japan
Prior art keywords
lead
resin
utility
registration request
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP140989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP140989U priority Critical patent/JPH0292943U/ja
Publication of JPH0292943U publication Critical patent/JPH0292943U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はそれぞれ本考案の一実施
例を示すバイポーラ・トランジスタの平面図、第
3図は従来の樹脂封止型バイポーラ・トランジス
タの平面図である。 1……放熱板リード(コレクタ)、2……半導
体ペレツト、3……ボンデイング線、4……エミ
ツタ・リード、4a,4′a,5a,5′a……
拡大部、5……ベース・リード、6……封止樹脂
層。
1 and 2 are plan views of a bipolar transistor showing one embodiment of the present invention, and FIG. 3 is a plan view of a conventional resin-sealed bipolar transistor. 1... Heat sink lead (collector), 2... Semiconductor pellet, 3... Bonding wire, 4... Emitter lead, 4a, 4'a, 5a, 5'a...
Enlarged portion, 5...Base lead, 6...Sealing resin layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトを引出リードの一部と共に樹脂
被覆する樹脂封止型半導体装置において、前記引
出リードのリード幅が封止樹脂層内において局部
的に拡大されていることを特徴とする樹脂封止型
半導体装置。
A resin-sealed semiconductor device in which a semiconductor pellet is resin-coated together with a part of a lead-out lead, characterized in that the lead width of the lead-out lead is locally expanded within the encapsulation resin layer. Device.
JP140989U 1989-01-09 1989-01-09 Pending JPH0292943U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP140989U JPH0292943U (en) 1989-01-09 1989-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP140989U JPH0292943U (en) 1989-01-09 1989-01-09

Publications (1)

Publication Number Publication Date
JPH0292943U true JPH0292943U (en) 1990-07-24

Family

ID=31201270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP140989U Pending JPH0292943U (en) 1989-01-09 1989-01-09

Country Status (1)

Country Link
JP (1) JPH0292943U (en)

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