JPH0292943U - - Google Patents
Info
- Publication number
- JPH0292943U JPH0292943U JP140989U JP140989U JPH0292943U JP H0292943 U JPH0292943 U JP H0292943U JP 140989 U JP140989 U JP 140989U JP 140989 U JP140989 U JP 140989U JP H0292943 U JPH0292943 U JP H0292943U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- utility
- registration request
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第1図および第2図はそれぞれ本考案の一実施
例を示すバイポーラ・トランジスタの平面図、第
3図は従来の樹脂封止型バイポーラ・トランジス
タの平面図である。
1……放熱板リード(コレクタ)、2……半導
体ペレツト、3……ボンデイング線、4……エミ
ツタ・リード、4a,4′a,5a,5′a……
拡大部、5……ベース・リード、6……封止樹脂
層。
1 and 2 are plan views of a bipolar transistor showing one embodiment of the present invention, and FIG. 3 is a plan view of a conventional resin-sealed bipolar transistor. 1... Heat sink lead (collector), 2... Semiconductor pellet, 3... Bonding wire, 4... Emitter lead, 4a, 4'a, 5a, 5'a...
Enlarged portion, 5...Base lead, 6...Sealing resin layer.
Claims (1)
被覆する樹脂封止型半導体装置において、前記引
出リードのリード幅が封止樹脂層内において局部
的に拡大されていることを特徴とする樹脂封止型
半導体装置。 A resin-sealed semiconductor device in which a semiconductor pellet is resin-coated together with a part of a lead-out lead, characterized in that the lead width of the lead-out lead is locally expanded within the encapsulation resin layer. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP140989U JPH0292943U (en) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP140989U JPH0292943U (en) | 1989-01-09 | 1989-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0292943U true JPH0292943U (en) | 1990-07-24 |
Family
ID=31201270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP140989U Pending JPH0292943U (en) | 1989-01-09 | 1989-01-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0292943U (en) |
-
1989
- 1989-01-09 JP JP140989U patent/JPH0292943U/ja active Pending