JPS6448041U - - Google Patents
Info
- Publication number
- JPS6448041U JPS6448041U JP14256987U JP14256987U JPS6448041U JP S6448041 U JPS6448041 U JP S6448041U JP 14256987 U JP14256987 U JP 14256987U JP 14256987 U JP14256987 U JP 14256987U JP S6448041 U JPS6448041 U JP S6448041U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- added
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002808 molecular sieve Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の半導体装置の縦断面図、第
２図は第１図のＡ部の拡大図である。
１……半導体素子、２……アイランド、３……
リード、４……ボンデイングワイヤ、５……封入
樹脂、６……モルキユラシーブ、７……二酸化珪
素。
FIG. 1 is a longitudinal sectional view of the semiconductor device of the present invention, and FIG. 2 is an enlarged view of section A in FIG. 1. 1...Semiconductor element, 2...Island, 3...
Lead, 4... bonding wire, 5... sealing resin, 6... molecular sieve, 7... silicon dioxide.
Claims (1)
質フイラーを添加したことを特徴とする半導体装
置。 A semiconductor device characterized in that a porous filler is added to an encapsulating resin component in a resin-encapsulated semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256987U JPS6448041U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256987U JPS6448041U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448041U true JPS6448041U (en) | 1989-03-24 |
Family
ID=31408641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14256987U Pending JPS6448041U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448041U (en) |
-
1987
- 1987-09-18 JP JP14256987U patent/JPS6448041U/ja active Pending