JPH0312446U - - Google Patents
Info
- Publication number
- JPH0312446U JPH0312446U JP7274489U JP7274489U JPH0312446U JP H0312446 U JPH0312446 U JP H0312446U JP 7274489 U JP7274489 U JP 7274489U JP 7274489 U JP7274489 U JP 7274489U JP H0312446 U JPH0312446 U JP H0312446U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- cooling
- screw
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Description
第１図はこの考案の一実施例による半導体素子
冷却方法を示す断面図、第２図はこの考案の一実
施例による空洞のあるネジを示す一部破断図、第
３図はこの考案の一実施例による半導体装置とヒ
ートシンクの接合状態を示す正面図及び側面図、
第４図は従来の半導体装置とヒートシンクの接合
状態を示す図である。１……半導体素子、２……
ヒートシンク、４……空洞のあるネジである。な
お、図中、同一符号は同一または相当部分を示す
。
Fig. 1 is a cross-sectional view showing a semiconductor device cooling method according to an embodiment of this invention, Fig. 2 is a partially cutaway view showing a hollow screw according to an embodiment of this invention, and Fig. 3 is an embodiment of this invention. A front view and a side view showing a bonded state of a semiconductor device and a heat sink according to an example,
FIG. 4 is a diagram showing a state of bonding between a conventional semiconductor device and a heat sink. 1... Semiconductor element, 2...
Heat sink, 4... It is a screw with a cavity. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
において、ネジに空洞を造り風が通るようにし冷
却効果を高めた事を特徴とする半導体素子冷却用
締付装置。 A tightening device for cooling a semiconductor device, characterized in that a cavity is formed in the screw that connects the semiconductor device and the heat sink to allow air to pass through, thereby increasing the cooling effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7274489U JPH0312446U (en) | 1989-06-21 | 1989-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7274489U JPH0312446U (en) | 1989-06-21 | 1989-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0312446U true JPH0312446U (en) | 1991-02-07 |
Family
ID=31610953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7274489U Pending JPH0312446U (en) | 1989-06-21 | 1989-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312446U (en) |
-
1989
- 1989-06-21 JP JP7274489U patent/JPH0312446U/ja active Pending