JPH0327053U - - Google Patents
Info
- Publication number
- JPH0327053U JPH0327053U JP8753289U JP8753289U JPH0327053U JP H0327053 U JPH0327053 U JP H0327053U JP 8753289 U JP8753289 U JP 8753289U JP 8753289 U JP8753289 U JP 8753289U JP H0327053 U JPH0327053 U JP H0327053U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- chip
- section
- package
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 2
Description
第１図は本考案の一実施例を示す断面図である
。
１……ＩＣのパツケージ、２……ＩＣのチツプ
、３……ＩＣピン、４……冷却用ペルチエ部、５
……温度センサ部、６……温度制御部、Ａ……温
度信号、Ｂ……供給電源。
FIG. 1 is a sectional view showing an embodiment of the present invention. 1... IC package, 2... IC chip, 3... IC pin, 4... Cooling Peltier part, 5
...Temperature sensor unit, 6...Temperature control unit, A...Temperature signal, B...Power supply.
Claims (1)
おいて、チツプ温度を側定する温度センサとチツ
プを冷却する冷却用ペルチエ部をパツケージに内
蔵し、さらに、温度センサの出力に基づいて冷却
用ペルチエ部の温度制御を行う温度制御部を有す
ることを特徴とする集積回路。 In an integrated circuit in which a chip is built into a package, a temperature sensor that measures the chip temperature and a cooling Peltier section that cools the chip are built into the package, and the temperature of the cooling Peltier section is determined based on the output of the temperature sensor. An integrated circuit characterized by having a temperature control section that performs control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8753289U JPH0327053U (en) | 1989-07-26 | 1989-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8753289U JPH0327053U (en) | 1989-07-26 | 1989-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327053U true JPH0327053U (en) | 1991-03-19 |
Family
ID=31637176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8753289U Pending JPH0327053U (en) | 1989-07-26 | 1989-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327053U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100714A (en) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | Semiconductor device |
-
1989
- 1989-07-26 JP JP8753289U patent/JPH0327053U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100714A (en) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | Semiconductor device |
| JP4712948B2 (en) * | 2000-09-21 | 2011-06-29 | イビデン株式会社 | Semiconductor device |