JPH01137639U - - Google Patents

Info

Publication number
JPH01137639U
JPH01137639U JP3400188U JP3400188U JPH01137639U JP H01137639 U JPH01137639 U JP H01137639U JP 3400188 U JP3400188 U JP 3400188U JP 3400188 U JP3400188 U JP 3400188U JP H01137639 U JPH01137639 U JP H01137639U
Authority
JP
Japan
Prior art keywords
power
cooling device
electronic cooling
supplied
received signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3400188U
Other languages
Japanese (ja)
Other versions
JPH0749875Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988034001U priority Critical patent/JPH0749875Y2/en
Publication of JPH01137639U publication Critical patent/JPH01137639U/ja
Application granted granted Critical
Publication of JPH0749875Y2 publication Critical patent/JPH0749875Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Superheterodyne Receivers (AREA)
  • Noise Elimination (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の要部回路図、第2図
は同上の直列負荷方式とした場合の要部回路図、
第3図は同上のコンバータの電源回路図、第4図
は同上の半導体素子を電子冷却する場合のモデル
図、第5図は同上の電子冷却する場合の具体構造
を示す断面図、第6図は同上のサーミスタを付加
した場合の断面図、第7図は同上のサーミスタの
特性図、第8図は同上の制御回路図、第9図はコ
ンバータの具体回路図である。 1は半導体素子、12は電子冷却装置、Aはコ
ンバータである。
Figure 1 is a circuit diagram of the main parts of an embodiment of the present invention, Figure 2 is a circuit diagram of the main parts when using the same series load method as above,
Fig. 3 is a power supply circuit diagram of the above converter, Fig. 4 is a model diagram when the above semiconductor element is electronically cooled, Fig. 5 is a sectional view showing a specific structure when the above semiconductor element is electronically cooled, and Fig. 6 7 is a characteristic diagram of the thermistor, FIG. 8 is a control circuit diagram, and FIG. 9 is a specific circuit diagram of the converter. 1 is a semiconductor element, 12 is an electronic cooling device, and A is a converter.

Claims (1)

【実用新案登録請求の範囲】 (1) 外部から電源が供給され受信した信号を所
定の周波数に変換して出力するコンバータにおい
て、受信した信号を増幅する半導体素子を冷却す
る電子冷却装置と、外部から供給される電力分と
内部で消費される電力分との差の電力分を上記電
子冷却装置の電源とする電源供給手段とを具備し
て成ることを特徴とするローノイズコンバータ。 (2) 外部から電源が供給され受信した信号を所
定の周波数に変換して出力するコンバータにおい
て、受信した信号を増幅する半導体素子を冷却す
る電子冷却装置と、外部から供給される電力分と
内部で消費される電力分との差の電力分を上記電
子冷却装置の電源とする電源供給手段と、上記半
導体素子を密閉する密閉手段とを具備して成るこ
とを特徴とするローノイズコンバータ。
[Claims for Utility Model Registration] (1) In a converter that is supplied with power from an external source and converts a received signal to a predetermined frequency and outputs the converted signal, an electronic cooling device that cools a semiconductor element that amplifies the received signal; 1. A low-noise converter comprising: power supply means that uses the difference between the power supplied from the electronic cooling device and the power consumed internally as a power source for the electronic cooling device. (2) In a converter that is supplied with power from the outside and converts the received signal to a predetermined frequency and outputs it, there is an electronic cooling device that cools the semiconductor element that amplifies the received signal, and a power supply that is supplied from the outside and the inside. 1. A low-noise converter comprising: a power supply means for supplying power to the electronic cooling device using the difference in power from the power consumed by the electronic cooling device; and a sealing means for sealing the semiconductor element.
JP1988034001U 1988-03-15 1988-03-15 Low noise converter Expired - Lifetime JPH0749875Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988034001U JPH0749875Y2 (en) 1988-03-15 1988-03-15 Low noise converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988034001U JPH0749875Y2 (en) 1988-03-15 1988-03-15 Low noise converter

Publications (2)

Publication Number Publication Date
JPH01137639U true JPH01137639U (en) 1989-09-20
JPH0749875Y2 JPH0749875Y2 (en) 1995-11-13

Family

ID=31260721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988034001U Expired - Lifetime JPH0749875Y2 (en) 1988-03-15 1988-03-15 Low noise converter

Country Status (1)

Country Link
JP (1) JPH0749875Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068955A (en) * 2001-08-24 2003-03-07 Nec Corp Temperature distribution control electronic cooling unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184830A (en) * 1982-04-22 1983-10-28 Nec Corp Receiver
JPS617041U (en) * 1984-06-18 1986-01-16 三菱重工業株式会社 Electronic cooling element moisture proofing device
JPS61142288U (en) * 1985-02-26 1986-09-02

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55141808A (en) * 1979-04-23 1980-11-06 Nippon Telegr & Teleph Corp <Ntt> Antenna reflection mirror surface of expansion type

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184830A (en) * 1982-04-22 1983-10-28 Nec Corp Receiver
JPS617041U (en) * 1984-06-18 1986-01-16 三菱重工業株式会社 Electronic cooling element moisture proofing device
JPS61142288U (en) * 1985-02-26 1986-09-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068955A (en) * 2001-08-24 2003-03-07 Nec Corp Temperature distribution control electronic cooling unit
JP4706149B2 (en) * 2001-08-24 2011-06-22 日本電気株式会社 Temperature distribution control electronic cooling device

Also Published As

Publication number Publication date
JPH0749875Y2 (en) 1995-11-13

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