JPS5484473A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5484473A JPS5484473A JP15171177A JP15171177A JPS5484473A JP S5484473 A JPS5484473 A JP S5484473A JP 15171177 A JP15171177 A JP 15171177A JP 15171177 A JP15171177 A JP 15171177A JP S5484473 A JPS5484473 A JP S5484473A
- Authority
- JP
- Japan
- Prior art keywords
- container
- heating
- wafers
- wafer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To lessen the generation of crystal strains and curves through gradual heating and cooling by arranging wafers not as they are exposed in a heating container, but after they are installed in a wafer container when semiconductor wafers are heat-treated.
CONSTITUTION: Upper body 5a and lower body 5b, which form a cylinder when combined, constitute wafer container 5 and several partitioning boards 5c and 5c' supporting a wafer are provided into the container. Further, gap 5d' through which external air flows is made at the junction part between upper body 5a and lower body 5b. Container 5 in this shape is made of SiC or the like and wafers are installed in this contianer, which is set in the heating container for a heat treatment. As a result, they can be heated gradually in an atmosphere sealed in the heating container and even during cooling after the heating, no sudden variation in temperature is caused. No defect is therefore generated and electric characteristics of the obtained semiconductor device are excellent.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15171177A JPS5484473A (en) | 1977-12-19 | 1977-12-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15171177A JPS5484473A (en) | 1977-12-19 | 1977-12-19 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5484473A true JPS5484473A (en) | 1979-07-05 |
Family
ID=15524593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15171177A Pending JPS5484473A (en) | 1977-12-19 | 1977-12-19 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5484473A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02248039A (en) * | 1989-03-20 | 1990-10-03 | Fujitsu Ltd | Transfer holding tool for semiconductor wafer |
-
1977
- 1977-12-19 JP JP15171177A patent/JPS5484473A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02248039A (en) * | 1989-03-20 | 1990-10-03 | Fujitsu Ltd | Transfer holding tool for semiconductor wafer |
JP2748325B2 (en) * | 1989-03-20 | 1998-05-06 | 富士通株式会社 | Heat treatment method for semiconductor wafer |
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