JPS5691452A - Resin-sealed type semiconductor device - Google Patents
Resin-sealed type semiconductor deviceInfo
- Publication number
- JPS5691452A JPS5691452A JP17010179A JP17010179A JPS5691452A JP S5691452 A JPS5691452 A JP S5691452A JP 17010179 A JP17010179 A JP 17010179A JP 17010179 A JP17010179 A JP 17010179A JP S5691452 A JPS5691452 A JP S5691452A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plate
- electrode
- pellet
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a pellet from concentration of stress caused by difference in thermal expansion of constituent material, by providing a projecting piece on semiconductor pellet-attached surface of a supporting body and putting resin around the projecting piece. CONSTITUTION:A reinforcing electrode plate 5 is composed of a copper plate which is machined into a U-shape configuration and punched to ensure satisfactory joining with resin 4. The reinforcing electrode plate 5 is fixed onto a plate electrode 3a by a soldering material 2c. A diode pellet 1 and a lead electrode 3b are fixed onto the reinforcing electrode plate 5 by solders 2a and 2b, respectively, and then an entire portion is further processed by molding of resin. By doing so, joining area of the resin to be joined onto the plate electrode side is increased and the reinforcing electrode is machined into such a configuration as to be well engaged with resin, and therefore, it is possible to eliminate such defects as damage of the resin, deterioration of joining performance between the resin and the plate electrode and concentration of stress on the pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17010179A JPS5953706B2 (en) | 1979-12-25 | 1979-12-25 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17010179A JPS5953706B2 (en) | 1979-12-25 | 1979-12-25 | Resin-encapsulated semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5691452A true JPS5691452A (en) | 1981-07-24 |
| JPS5953706B2 JPS5953706B2 (en) | 1984-12-26 |
Family
ID=15898646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17010179A Expired JPS5953706B2 (en) | 1979-12-25 | 1979-12-25 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5953706B2 (en) |
-
1979
- 1979-12-25 JP JP17010179A patent/JPS5953706B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5953706B2 (en) | 1984-12-26 |
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