JPS5673456A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5673456A JPS5673456A JP15022779A JP15022779A JPS5673456A JP S5673456 A JPS5673456 A JP S5673456A JP 15022779 A JP15022779 A JP 15022779A JP 15022779 A JP15022779 A JP 15022779A JP S5673456 A JPS5673456 A JP S5673456A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- heat sink
- mask member
- supporting pieces
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To make the contact of a lead with a heat sink of a semiconductor device to be nil when the electrode being provided in the element is to be connected to the lead using fine metal wire and to reduce the cost by a method wherein the heat sink to load the semiconductor element on it placing a mask member between them is integrated with the lead in one body. CONSTITUTION:Projecting parts 2 are formed at the corner parts on the upper surface 1a of the heat sink 1, and frame parts 3a, 3b, tie bars 3b, 3c, lead pieces 31-37, supporting pieces 38, 39 are provided to the lead 3 to be arranged on it consisting of the same metal material with the heat sink. The surfaces of the heat sink 1 and the lead 3 are previously plated respectively with Ni, etc., the projecting parts 2 are inserted into the holes being provided in the supporting pieces 38, 39, and the projecting parts 2 are squashed to fix the heat sink 1 and the lead 3 by calking. After then the integrated heat sink 1 and the lead 3 are fixed on a lead frame prepared in addition placing the mask member 4 between them, the semiconductor element 8 is soldered on the heat sink 1 using an opening part 5 in the mask member 4, the prescribed connection is performed and the tie bars and the supporting pieces are cut off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15022779A JPS5919469B2 (en) | 1979-11-19 | 1979-11-19 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15022779A JPS5919469B2 (en) | 1979-11-19 | 1979-11-19 | Manufacturing method of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5673456A true JPS5673456A (en) | 1981-06-18 |
| JPS5919469B2 JPS5919469B2 (en) | 1984-05-07 |
Family
ID=15492314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15022779A Expired JPS5919469B2 (en) | 1979-11-19 | 1979-11-19 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5919469B2 (en) |
-
1979
- 1979-11-19 JP JP15022779A patent/JPS5919469B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5919469B2 (en) | 1984-05-07 |
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