JPS5684458A - Nonelectrolytic plating bath composition and continuous plating therewith - Google Patents
Nonelectrolytic plating bath composition and continuous plating therewithInfo
- Publication number
- JPS5684458A JPS5684458A JP16239079A JP16239079A JPS5684458A JP S5684458 A JPS5684458 A JP S5684458A JP 16239079 A JP16239079 A JP 16239079A JP 16239079 A JP16239079 A JP 16239079A JP S5684458 A JPS5684458 A JP S5684458A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating bath
- metal
- nonelectrolytic
- ion sources
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 10
- 239000000203 mixture Substances 0.000 title abstract 2
- 229910021645 metal ion Inorganic materials 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 239000008139 complexing agent Substances 0.000 abstract 3
- 239000007864 aqueous solution Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L copper(II) hydroxide Inorganic materials [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 abstract 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 abstract 1
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- -1 metal complex ions Chemical class 0.000 abstract 1
- 229910000000 metal hydroxide Inorganic materials 0.000 abstract 1
- 150000004692 metal hydroxides Chemical class 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5684458A true JPS5684458A (en) | 1981-07-09 |
| JPS6317906B2 JPS6317906B2 (enrdf_load_stackoverflow) | 1988-04-15 |
Family
ID=15753665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16239079A Granted JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5684458A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408916A (zh) * | 2019-08-26 | 2019-11-05 | 惠州市安泰普表面处理科技有限公司 | 化学镀镍方法 |
-
1979
- 1979-12-14 JP JP16239079A patent/JPS5684458A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408916A (zh) * | 2019-08-26 | 2019-11-05 | 惠州市安泰普表面处理科技有限公司 | 化学镀镍方法 |
| CN110408916B (zh) * | 2019-08-26 | 2021-08-17 | 惠州市安泰普表面处理科技有限公司 | 化学镀镍方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317906B2 (enrdf_load_stackoverflow) | 1988-04-15 |
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