JPS5684458A - Nonelectrolytic plating bath composition and continuous plating therewith - Google Patents

Nonelectrolytic plating bath composition and continuous plating therewith

Info

Publication number
JPS5684458A
JPS5684458A JP16239079A JP16239079A JPS5684458A JP S5684458 A JPS5684458 A JP S5684458A JP 16239079 A JP16239079 A JP 16239079A JP 16239079 A JP16239079 A JP 16239079A JP S5684458 A JPS5684458 A JP S5684458A
Authority
JP
Japan
Prior art keywords
plating
plating bath
metal
nonelectrolytic
ion sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16239079A
Other languages
Japanese (ja)
Other versions
JPS6317906B2 (en
Inventor
Masao Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elna Co Ltd
Original Assignee
Elna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elna Co Ltd filed Critical Elna Co Ltd
Priority to JP16239079A priority Critical patent/JPS5684458A/en
Publication of JPS5684458A publication Critical patent/JPS5684458A/en
Publication of JPS6317906B2 publication Critical patent/JPS6317906B2/ja
Granted legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To obtain a high quality plated film by keeping a plating bath always under a stable control by a continuous plating method using a nonelectrolytic plating bath containing metal ion sources which are insoluble in water and alkaline aqueous solution and are capable of easily forming complexes with complexing agent.
CONSTITUTION: A nonelectrolytic plating bath composition consists of metal ion sources, a reducing agent (e.g., HCHO), a complexing agent (e.g., ETA.2Na. 2H2O), a pH regulator (e.g., NaOH), a bath stabilizer, and a plating improver. The metal ion sources used include one or more of metal salts, metal oxides, and metal hydroxides which are insoluble in water and alkaline aqueous solutions and also capable of easily forming complexes with a complexing agent, e.g., Cu(OH)2. Thus, a plating bath in which the concentration of metal complex ions can be kept constant during the continuous plating process can be obtained. In the plating bath, metal ions can be automatically controlled by an inexpensive device without the use of special measuring instrument.
COPYRIGHT: (C)1981,JPO&Japio
JP16239079A 1979-12-14 1979-12-14 Nonelectrolytic plating bath composition and continuous plating therewith Granted JPS5684458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16239079A JPS5684458A (en) 1979-12-14 1979-12-14 Nonelectrolytic plating bath composition and continuous plating therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16239079A JPS5684458A (en) 1979-12-14 1979-12-14 Nonelectrolytic plating bath composition and continuous plating therewith

Publications (2)

Publication Number Publication Date
JPS5684458A true JPS5684458A (en) 1981-07-09
JPS6317906B2 JPS6317906B2 (en) 1988-04-15

Family

ID=15753665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16239079A Granted JPS5684458A (en) 1979-12-14 1979-12-14 Nonelectrolytic plating bath composition and continuous plating therewith

Country Status (1)

Country Link
JP (1) JPS5684458A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110408916A (en) * 2019-08-26 2019-11-05 惠州市安泰普表面处理科技有限公司 Chemical nickel plating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110408916A (en) * 2019-08-26 2019-11-05 惠州市安泰普表面处理科技有限公司 Chemical nickel plating method
CN110408916B (en) * 2019-08-26 2021-08-17 惠州市安泰普表面处理科技有限公司 Chemical nickel plating method

Also Published As

Publication number Publication date
JPS6317906B2 (en) 1988-04-15

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