JPS5684458A - Nonelectrolytic plating bath composition and continuous plating therewith - Google Patents
Nonelectrolytic plating bath composition and continuous plating therewithInfo
- Publication number
- JPS5684458A JPS5684458A JP16239079A JP16239079A JPS5684458A JP S5684458 A JPS5684458 A JP S5684458A JP 16239079 A JP16239079 A JP 16239079A JP 16239079 A JP16239079 A JP 16239079A JP S5684458 A JPS5684458 A JP S5684458A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating bath
- metal
- nonelectrolytic
- ion sources
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To obtain a high quality plated film by keeping a plating bath always under a stable control by a continuous plating method using a nonelectrolytic plating bath containing metal ion sources which are insoluble in water and alkaline aqueous solution and are capable of easily forming complexes with complexing agent.
CONSTITUTION: A nonelectrolytic plating bath composition consists of metal ion sources, a reducing agent (e.g., HCHO), a complexing agent (e.g., ETA.2Na. 2H2O), a pH regulator (e.g., NaOH), a bath stabilizer, and a plating improver. The metal ion sources used include one or more of metal salts, metal oxides, and metal hydroxides which are insoluble in water and alkaline aqueous solutions and also capable of easily forming complexes with a complexing agent, e.g., Cu(OH)2. Thus, a plating bath in which the concentration of metal complex ions can be kept constant during the continuous plating process can be obtained. In the plating bath, metal ions can be automatically controlled by an inexpensive device without the use of special measuring instrument.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5684458A true JPS5684458A (en) | 1981-07-09 |
JPS6317906B2 JPS6317906B2 (en) | 1988-04-15 |
Family
ID=15753665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16239079A Granted JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5684458A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110408916A (en) * | 2019-08-26 | 2019-11-05 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating method |
-
1979
- 1979-12-14 JP JP16239079A patent/JPS5684458A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110408916A (en) * | 2019-08-26 | 2019-11-05 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating method |
CN110408916B (en) * | 2019-08-26 | 2021-08-17 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating method |
Also Published As
Publication number | Publication date |
---|---|
JPS6317906B2 (en) | 1988-04-15 |
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