JPS56834A - Additive for high-molecular material - Google Patents
Additive for high-molecular materialInfo
- Publication number
- JPS56834A JPS56834A JP7459579A JP7459579A JPS56834A JP S56834 A JPS56834 A JP S56834A JP 7459579 A JP7459579 A JP 7459579A JP 7459579 A JP7459579 A JP 7459579A JP S56834 A JPS56834 A JP S56834A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- alumina powder
- additive
- particle diameter
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54074595A JPS5822055B2 (ja) | 1979-06-15 | 1979-06-15 | 高分子物質用配合剤 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54074595A JPS5822055B2 (ja) | 1979-06-15 | 1979-06-15 | 高分子物質用配合剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56834A true JPS56834A (en) | 1981-01-07 |
JPS5822055B2 JPS5822055B2 (ja) | 1983-05-06 |
Family
ID=13551654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54074595A Expired JPS5822055B2 (ja) | 1979-06-15 | 1979-06-15 | 高分子物質用配合剤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5822055B2 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320340A (ja) * | 1986-07-14 | 1988-01-28 | Showa Denko Kk | 高熱伝導性ゴム・プラスチック組成物 |
JPH03229763A (ja) * | 1990-02-02 | 1991-10-11 | Kanebo Ltd | 熱可塑性樹脂組成物 |
JPH08319425A (ja) * | 1995-05-25 | 1996-12-03 | Toray Dow Corning Silicone Co Ltd | 熱伝導性シリコーンゴム組成物 |
JPH08325457A (ja) * | 1995-05-29 | 1996-12-10 | Toray Dow Corning Silicone Co Ltd | 熱伝導性シリコーンゴム組成物 |
FR2742763A1 (fr) * | 1995-12-22 | 1997-06-27 | Rhone Poulenc Chimie | Elastomere silicone a haute conductibilite thermique |
JP2001316111A (ja) * | 2000-04-28 | 2001-11-13 | Showa Denko Kk | 充填性の優れた酸化アルミニウム粉体及びその製法 |
JP2005015788A (ja) * | 2003-06-04 | 2005-01-20 | Showa Denko Kk | 樹脂充填用コランダム及び樹脂組成物 |
JP2005209765A (ja) * | 2004-01-21 | 2005-08-04 | Denki Kagaku Kogyo Kk | 混合粉末及びその用途 |
JPWO2015056523A1 (ja) * | 2013-10-17 | 2017-03-09 | 住友ベークライト株式会社 | エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置 |
CN106935342A (zh) * | 2009-12-04 | 2017-07-07 | Abb研究有限公司 | 高压电涌避雷器 |
WO2022071131A1 (ja) * | 2020-09-29 | 2022-04-07 | デンカ株式会社 | 球状アルミナ粉末、樹脂組成物、半導体封止材料 |
-
1979
- 1979-06-15 JP JP54074595A patent/JPS5822055B2/ja not_active Expired
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320340A (ja) * | 1986-07-14 | 1988-01-28 | Showa Denko Kk | 高熱伝導性ゴム・プラスチック組成物 |
JPH048465B2 (ja) * | 1986-07-14 | 1992-02-17 | ||
JPH03229763A (ja) * | 1990-02-02 | 1991-10-11 | Kanebo Ltd | 熱可塑性樹脂組成物 |
JPH08319425A (ja) * | 1995-05-25 | 1996-12-03 | Toray Dow Corning Silicone Co Ltd | 熱伝導性シリコーンゴム組成物 |
JPH08325457A (ja) * | 1995-05-29 | 1996-12-10 | Toray Dow Corning Silicone Co Ltd | 熱伝導性シリコーンゴム組成物 |
FR2742763A1 (fr) * | 1995-12-22 | 1997-06-27 | Rhone Poulenc Chimie | Elastomere silicone a haute conductibilite thermique |
WO1997023555A1 (fr) * | 1995-12-22 | 1997-07-03 | Rhodia Chimie | Elastomere silicone a haute conductibilite thermique |
US6284829B1 (en) | 1995-12-22 | 2001-09-04 | Rhodia Chimie | Silicone elastomer of high thermal conductivity |
JP2001316111A (ja) * | 2000-04-28 | 2001-11-13 | Showa Denko Kk | 充填性の優れた酸化アルミニウム粉体及びその製法 |
JP4514894B2 (ja) * | 2000-04-28 | 2010-07-28 | 昭和電工株式会社 | 充填性の優れた酸化アルミニウム粉体及びその製法 |
JP2005015788A (ja) * | 2003-06-04 | 2005-01-20 | Showa Denko Kk | 樹脂充填用コランダム及び樹脂組成物 |
JP4526064B2 (ja) * | 2003-06-04 | 2010-08-18 | 昭和電工株式会社 | 樹脂充填用コランダム及び樹脂組成物 |
JP2005209765A (ja) * | 2004-01-21 | 2005-08-04 | Denki Kagaku Kogyo Kk | 混合粉末及びその用途 |
JP4481019B2 (ja) * | 2004-01-21 | 2010-06-16 | 電気化学工業株式会社 | 混合粉末及びその用途 |
CN106935342A (zh) * | 2009-12-04 | 2017-07-07 | Abb研究有限公司 | 高压电涌避雷器 |
JPWO2015056523A1 (ja) * | 2013-10-17 | 2017-03-09 | 住友ベークライト株式会社 | エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置 |
WO2022071131A1 (ja) * | 2020-09-29 | 2022-04-07 | デンカ株式会社 | 球状アルミナ粉末、樹脂組成物、半導体封止材料 |
Also Published As
Publication number | Publication date |
---|---|
JPS5822055B2 (ja) | 1983-05-06 |
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