JPS56834A - Additive for high-molecular material - Google Patents

Additive for high-molecular material

Info

Publication number
JPS56834A
JPS56834A JP7459579A JP7459579A JPS56834A JP S56834 A JPS56834 A JP S56834A JP 7459579 A JP7459579 A JP 7459579A JP 7459579 A JP7459579 A JP 7459579A JP S56834 A JPS56834 A JP S56834A
Authority
JP
Japan
Prior art keywords
alumina
alumina powder
additive
particle diameter
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7459579A
Other languages
English (en)
Other versions
JPS5822055B2 (ja
Inventor
Toshiro Sakaida
Naoaki Oishi
Hikari Hasegawa
Katsunobu Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP54074595A priority Critical patent/JPS5822055B2/ja
Publication of JPS56834A publication Critical patent/JPS56834A/ja
Publication of JPS5822055B2 publication Critical patent/JPS5822055B2/ja
Expired legal-status Critical Current

Links

JP54074595A 1979-06-15 1979-06-15 高分子物質用配合剤 Expired JPS5822055B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54074595A JPS5822055B2 (ja) 1979-06-15 1979-06-15 高分子物質用配合剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54074595A JPS5822055B2 (ja) 1979-06-15 1979-06-15 高分子物質用配合剤

Publications (2)

Publication Number Publication Date
JPS56834A true JPS56834A (en) 1981-01-07
JPS5822055B2 JPS5822055B2 (ja) 1983-05-06

Family

ID=13551654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54074595A Expired JPS5822055B2 (ja) 1979-06-15 1979-06-15 高分子物質用配合剤

Country Status (1)

Country Link
JP (1) JPS5822055B2 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320340A (ja) * 1986-07-14 1988-01-28 Showa Denko Kk 高熱伝導性ゴム・プラスチック組成物
JPH03229763A (ja) * 1990-02-02 1991-10-11 Kanebo Ltd 熱可塑性樹脂組成物
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
FR2742763A1 (fr) * 1995-12-22 1997-06-27 Rhone Poulenc Chimie Elastomere silicone a haute conductibilite thermique
JP2001316111A (ja) * 2000-04-28 2001-11-13 Showa Denko Kk 充填性の優れた酸化アルミニウム粉体及びその製法
JP2005015788A (ja) * 2003-06-04 2005-01-20 Showa Denko Kk 樹脂充填用コランダム及び樹脂組成物
JP2005209765A (ja) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk 混合粉末及びその用途
JPWO2015056523A1 (ja) * 2013-10-17 2017-03-09 住友ベークライト株式会社 エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置
CN106935342A (zh) * 2009-12-04 2017-07-07 Abb研究有限公司 高压电涌避雷器
WO2022071131A1 (ja) * 2020-09-29 2022-04-07 デンカ株式会社 球状アルミナ粉末、樹脂組成物、半導体封止材料

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320340A (ja) * 1986-07-14 1988-01-28 Showa Denko Kk 高熱伝導性ゴム・プラスチック組成物
JPH048465B2 (ja) * 1986-07-14 1992-02-17
JPH03229763A (ja) * 1990-02-02 1991-10-11 Kanebo Ltd 熱可塑性樹脂組成物
JPH08319425A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
FR2742763A1 (fr) * 1995-12-22 1997-06-27 Rhone Poulenc Chimie Elastomere silicone a haute conductibilite thermique
WO1997023555A1 (fr) * 1995-12-22 1997-07-03 Rhodia Chimie Elastomere silicone a haute conductibilite thermique
US6284829B1 (en) 1995-12-22 2001-09-04 Rhodia Chimie Silicone elastomer of high thermal conductivity
JP2001316111A (ja) * 2000-04-28 2001-11-13 Showa Denko Kk 充填性の優れた酸化アルミニウム粉体及びその製法
JP4514894B2 (ja) * 2000-04-28 2010-07-28 昭和電工株式会社 充填性の優れた酸化アルミニウム粉体及びその製法
JP2005015788A (ja) * 2003-06-04 2005-01-20 Showa Denko Kk 樹脂充填用コランダム及び樹脂組成物
JP4526064B2 (ja) * 2003-06-04 2010-08-18 昭和電工株式会社 樹脂充填用コランダム及び樹脂組成物
JP2005209765A (ja) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk 混合粉末及びその用途
JP4481019B2 (ja) * 2004-01-21 2010-06-16 電気化学工業株式会社 混合粉末及びその用途
CN106935342A (zh) * 2009-12-04 2017-07-07 Abb研究有限公司 高压电涌避雷器
JPWO2015056523A1 (ja) * 2013-10-17 2017-03-09 住友ベークライト株式会社 エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置
WO2022071131A1 (ja) * 2020-09-29 2022-04-07 デンカ株式会社 球状アルミナ粉末、樹脂組成物、半導体封止材料

Also Published As

Publication number Publication date
JPS5822055B2 (ja) 1983-05-06

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