JPS5681945A - Assembling device - Google Patents

Assembling device

Info

Publication number
JPS5681945A
JPS5681945A JP15800679A JP15800679A JPS5681945A JP S5681945 A JPS5681945 A JP S5681945A JP 15800679 A JP15800679 A JP 15800679A JP 15800679 A JP15800679 A JP 15800679A JP S5681945 A JPS5681945 A JP S5681945A
Authority
JP
Japan
Prior art keywords
cover
lead frame
frame
pawl
curtain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15800679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250976B2 (enrdf_load_stackoverflow
Inventor
Yoshio Ohashi
Tadashi Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15800679A priority Critical patent/JPS5681945A/ja
Publication of JPS5681945A publication Critical patent/JPS5681945A/ja
Publication of JPS6250976B2 publication Critical patent/JPS6250976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP15800679A 1979-12-07 1979-12-07 Assembling device Granted JPS5681945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15800679A JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15800679A JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Publications (2)

Publication Number Publication Date
JPS5681945A true JPS5681945A (en) 1981-07-04
JPS6250976B2 JPS6250976B2 (enrdf_load_stackoverflow) 1987-10-28

Family

ID=15662188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15800679A Granted JPS5681945A (en) 1979-12-07 1979-12-07 Assembling device

Country Status (1)

Country Link
JP (1) JPS5681945A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925232A (ja) * 1982-07-31 1984-02-09 Shinkawa Ltd ワイヤボンディング装置
JPS5958830A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd ボンダ−用ワ−ク加熱装置
JPS60125734U (ja) * 1984-01-31 1985-08-24 関西日本電気株式会社 ポンデイング装置
JPS61212029A (ja) * 1985-03-18 1986-09-20 San Yakin Kogyo Kk 半導体装置のボンデイング
JPH0237733A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置
WO2010044287A1 (ja) * 2008-10-16 2010-04-22 株式会社新川 基板搬送装置及び基板搬送方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4694381B2 (ja) * 2006-02-10 2011-06-08 日本電産トーソク株式会社 ワーククランプ装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (enrdf_load_stackoverflow) * 1973-09-07 1975-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (enrdf_load_stackoverflow) * 1973-09-07 1975-05-08

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925232A (ja) * 1982-07-31 1984-02-09 Shinkawa Ltd ワイヤボンディング装置
JPS5958830A (ja) * 1982-09-28 1984-04-04 Shinkawa Ltd ボンダ−用ワ−ク加熱装置
JPS60125734U (ja) * 1984-01-31 1985-08-24 関西日本電気株式会社 ポンデイング装置
JPS61212029A (ja) * 1985-03-18 1986-09-20 San Yakin Kogyo Kk 半導体装置のボンデイング
JPH0237733A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置
WO2010044287A1 (ja) * 2008-10-16 2010-04-22 株式会社新川 基板搬送装置及び基板搬送方法
CN102177574A (zh) * 2008-10-16 2011-09-07 株式会社新川 基板运送装置及基板运送方法

Also Published As

Publication number Publication date
JPS6250976B2 (enrdf_load_stackoverflow) 1987-10-28

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