JPS5681940A - Pellet bonding device - Google Patents

Pellet bonding device

Info

Publication number
JPS5681940A
JPS5681940A JP15912179A JP15912179A JPS5681940A JP S5681940 A JPS5681940 A JP S5681940A JP 15912179 A JP15912179 A JP 15912179A JP 15912179 A JP15912179 A JP 15912179A JP S5681940 A JPS5681940 A JP S5681940A
Authority
JP
Japan
Prior art keywords
pellet
equipping
substrate
adjusting part
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15912179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249986B2 (enFirst
Inventor
Yoshio Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15912179A priority Critical patent/JPS5681940A/ja
Publication of JPS5681940A publication Critical patent/JPS5681940A/ja
Publication of JPS6249986B2 publication Critical patent/JPS6249986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP15912179A 1979-12-10 1979-12-10 Pellet bonding device Granted JPS5681940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15912179A JPS5681940A (en) 1979-12-10 1979-12-10 Pellet bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15912179A JPS5681940A (en) 1979-12-10 1979-12-10 Pellet bonding device

Publications (2)

Publication Number Publication Date
JPS5681940A true JPS5681940A (en) 1981-07-04
JPS6249986B2 JPS6249986B2 (enFirst) 1987-10-22

Family

ID=15686689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15912179A Granted JPS5681940A (en) 1979-12-10 1979-12-10 Pellet bonding device

Country Status (1)

Country Link
JP (1) JPS5681940A (enFirst)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202645A (ja) * 1983-04-30 1984-11-16 Nichiden Mach Ltd チツプオリエンタ−
JPS61182739A (ja) * 1985-02-07 1986-08-15 Shibayama Kikai Kk 半導体ウエハのプリポジシヨン装置における位置決め機構
JPS6237942A (ja) * 1985-08-13 1987-02-18 Matsushita Electronics Corp ペレツト位置決め装置
JPS6373529A (ja) * 1986-09-16 1988-04-04 Matsushita Electronics Corp ペレツト位置決め装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844545A (enFirst) * 1971-10-11 1973-06-26
JPS5442467U (enFirst) * 1977-08-29 1979-03-22
JPS54103157U (enFirst) * 1977-12-13 1979-07-20

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4844545A (enFirst) * 1971-10-11 1973-06-26
JPS5442467U (enFirst) * 1977-08-29 1979-03-22
JPS54103157U (enFirst) * 1977-12-13 1979-07-20

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202645A (ja) * 1983-04-30 1984-11-16 Nichiden Mach Ltd チツプオリエンタ−
JPS61182739A (ja) * 1985-02-07 1986-08-15 Shibayama Kikai Kk 半導体ウエハのプリポジシヨン装置における位置決め機構
JPS6237942A (ja) * 1985-08-13 1987-02-18 Matsushita Electronics Corp ペレツト位置決め装置
JPS6373529A (ja) * 1986-09-16 1988-04-04 Matsushita Electronics Corp ペレツト位置決め装置

Also Published As

Publication number Publication date
JPS6249986B2 (enFirst) 1987-10-22

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