JPS5681940A - Pellet bonding device - Google Patents
Pellet bonding deviceInfo
- Publication number
- JPS5681940A JPS5681940A JP15912179A JP15912179A JPS5681940A JP S5681940 A JPS5681940 A JP S5681940A JP 15912179 A JP15912179 A JP 15912179A JP 15912179 A JP15912179 A JP 15912179A JP S5681940 A JPS5681940 A JP S5681940A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- equipping
- substrate
- adjusting part
- collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
-
- H10W72/884—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Control Of Position Or Direction (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15912179A JPS5681940A (en) | 1979-12-10 | 1979-12-10 | Pellet bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15912179A JPS5681940A (en) | 1979-12-10 | 1979-12-10 | Pellet bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5681940A true JPS5681940A (en) | 1981-07-04 |
| JPS6249986B2 JPS6249986B2 (enExample) | 1987-10-22 |
Family
ID=15686689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15912179A Granted JPS5681940A (en) | 1979-12-10 | 1979-12-10 | Pellet bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5681940A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59202645A (ja) * | 1983-04-30 | 1984-11-16 | Nichiden Mach Ltd | チツプオリエンタ− |
| JPS61182739A (ja) * | 1985-02-07 | 1986-08-15 | Shibayama Kikai Kk | 半導体ウエハのプリポジシヨン装置における位置決め機構 |
| JPS6237942A (ja) * | 1985-08-13 | 1987-02-18 | Matsushita Electronics Corp | ペレツト位置決め装置 |
| JPS6373529A (ja) * | 1986-09-16 | 1988-04-04 | Matsushita Electronics Corp | ペレツト位置決め装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4844545A (enExample) * | 1971-10-11 | 1973-06-26 | ||
| JPS5442467U (enExample) * | 1977-08-29 | 1979-03-22 | ||
| JPS54103157U (enExample) * | 1977-12-13 | 1979-07-20 |
-
1979
- 1979-12-10 JP JP15912179A patent/JPS5681940A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4844545A (enExample) * | 1971-10-11 | 1973-06-26 | ||
| JPS5442467U (enExample) * | 1977-08-29 | 1979-03-22 | ||
| JPS54103157U (enExample) * | 1977-12-13 | 1979-07-20 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59202645A (ja) * | 1983-04-30 | 1984-11-16 | Nichiden Mach Ltd | チツプオリエンタ− |
| JPS61182739A (ja) * | 1985-02-07 | 1986-08-15 | Shibayama Kikai Kk | 半導体ウエハのプリポジシヨン装置における位置決め機構 |
| JPS6237942A (ja) * | 1985-08-13 | 1987-02-18 | Matsushita Electronics Corp | ペレツト位置決め装置 |
| JPS6373529A (ja) * | 1986-09-16 | 1988-04-04 | Matsushita Electronics Corp | ペレツト位置決め装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6249986B2 (enExample) | 1987-10-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IE801200L (en) | Semiconductor manufacture | |
| JPS5681940A (en) | Pellet bonding device | |
| EP0303404A3 (en) | Method of aligning wafers and device therefor | |
| US3100071A (en) | Tape clamping roller assembly | |
| JPS6395631A (ja) | ダイボンデイング装置 | |
| JPS533165A (en) | Wire bonding apparatus | |
| JPS56155164A (en) | Regulating mechanism for angle of taping | |
| JPS63218424A (ja) | 反転装置付テ−プ供給装置 | |
| JPS649634A (en) | Wafer alignment apparatus | |
| JPS5249811A (en) | Automatic assembling device | |
| JPS61198644A (ja) | ウエハの移し替え方法 | |
| JPS5228791A (en) | Boring device | |
| JPS51118381A (en) | Manufacturing process for semiconductor unit | |
| JP2539472B2 (ja) | 被処理物収納部支持機構 | |
| JPS5237770A (en) | Semiconductor device | |
| JPS6018276Y2 (ja) | 工作物搬送手段の旋回ア−ム | |
| JPS5318968A (en) | Semiconductor wafer arraying device | |
| JPS5534425A (en) | Wafer dicing device | |
| JPS5734346A (en) | Division of semiconductor wafer | |
| JPS5412568A (en) | Aligning method of semiconductor wafers | |
| EP0361959A3 (en) | A substrate conveying apparatus | |
| JPS63288714A (ja) | ダイシング治具 | |
| JPS5335372A (en) | Beveling method of wafers | |
| JPS5570639A (en) | Load transfer equipment for truck | |
| JP2528284Y2 (ja) | チップ部品整列機構 |