JPS5678172A - Manufacture of zener diode - Google Patents

Manufacture of zener diode

Info

Publication number
JPS5678172A
JPS5678172A JP13762879A JP13762879A JPS5678172A JP S5678172 A JPS5678172 A JP S5678172A JP 13762879 A JP13762879 A JP 13762879A JP 13762879 A JP13762879 A JP 13762879A JP S5678172 A JPS5678172 A JP S5678172A
Authority
JP
Japan
Prior art keywords
electrode
emitter
groove
base
collector junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13762879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325513B2 (enExample
Inventor
Seiichi Ishii
Hideharu Fujii
Atsushi Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13762879A priority Critical patent/JPS5678172A/ja
Publication of JPS5678172A publication Critical patent/JPS5678172A/ja
Publication of JPS6325513B2 publication Critical patent/JPS6325513B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/20—Breakdown diodes, e.g. avalanche diodes
    • H10D8/25—Zener diodes 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP13762879A 1979-10-26 1979-10-26 Manufacture of zener diode Granted JPS5678172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13762879A JPS5678172A (en) 1979-10-26 1979-10-26 Manufacture of zener diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13762879A JPS5678172A (en) 1979-10-26 1979-10-26 Manufacture of zener diode

Publications (2)

Publication Number Publication Date
JPS5678172A true JPS5678172A (en) 1981-06-26
JPS6325513B2 JPS6325513B2 (enExample) 1988-05-25

Family

ID=15203097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13762879A Granted JPS5678172A (en) 1979-10-26 1979-10-26 Manufacture of zener diode

Country Status (1)

Country Link
JP (1) JPS5678172A (enExample)

Also Published As

Publication number Publication date
JPS6325513B2 (enExample) 1988-05-25

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