JPS5678137A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5678137A
JPS5678137A JP15460779A JP15460779A JPS5678137A JP S5678137 A JPS5678137 A JP S5678137A JP 15460779 A JP15460779 A JP 15460779A JP 15460779 A JP15460779 A JP 15460779A JP S5678137 A JPS5678137 A JP S5678137A
Authority
JP
Japan
Prior art keywords
pellet
rubber
groove
dicer
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15460779A
Other languages
Japanese (ja)
Inventor
Ikuhisa Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15460779A priority Critical patent/JPS5678137A/en
Publication of JPS5678137A publication Critical patent/JPS5678137A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To prevent the chipping off of the pellet edge of a semiconductor wafer for the subject device by a method wherein a groove is provided on the semiconductor wafer using a dicer, a shock resistance insulating material is filled in and the pellet is cut together with the filler. CONSTITUTION:A groove is provided, using a dicer, on the wafer for which an element has been formed. Then the Si rubber 9, which contains a very small amount of hardening agent and turns into a sol-form at the normal temperature at the time of filling, is filled in the groove. Then the dicer 10 is penetrated into the rubber 9 and the pellet is cut by pushing the point 12 against the groove bottom 11. The Si rubber 9 remaining on the separated pellet has a low viscosity but it does not run down because it is on the rough surface 8, it absorbs the impact force given to the pellet bottom 11 at the time of cutting and the generation of microscopic cracks can be prevented. As chips are enveloped in the rubber 9, they do not scatter and pollute the wafer, and they can be removed after cutting by washing.
JP15460779A 1979-11-29 1979-11-29 Manufacture of semiconductor device Pending JPS5678137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15460779A JPS5678137A (en) 1979-11-29 1979-11-29 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15460779A JPS5678137A (en) 1979-11-29 1979-11-29 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5678137A true JPS5678137A (en) 1981-06-26

Family

ID=15587870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15460779A Pending JPS5678137A (en) 1979-11-29 1979-11-29 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5678137A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0610657A2 (en) * 1993-01-07 1994-08-17 Texas Instruments Incorporated Integrated partial sawing process
CN1076516C (en) * 1994-01-22 2001-12-19 德克萨斯仪器股份有限公司 Integrated partial sawing process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0610657A2 (en) * 1993-01-07 1994-08-17 Texas Instruments Incorporated Integrated partial sawing process
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5527744A (en) * 1993-01-07 1996-06-18 Texas Instruments Incorporated Wafer method for breaking a semiconductor
EP0610657A3 (en) * 1993-01-07 1997-02-05 Texas Instruments Inc Integrated partial sawing process.
CN1076516C (en) * 1994-01-22 2001-12-19 德克萨斯仪器股份有限公司 Integrated partial sawing process

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