JPS5675642A - Improved photoresist composition - Google Patents

Improved photoresist composition

Info

Publication number
JPS5675642A
JPS5675642A JP15395280A JP15395280A JPS5675642A JP S5675642 A JPS5675642 A JP S5675642A JP 15395280 A JP15395280 A JP 15395280A JP 15395280 A JP15395280 A JP 15395280A JP S5675642 A JPS5675642 A JP S5675642A
Authority
JP
Japan
Prior art keywords
photoresist composition
improved photoresist
improved
composition
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15395280A
Other languages
English (en)
Other versions
JPS6313526B2 (ja
Inventor
Ruusu Reo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hercules LLC
Original Assignee
Hercules LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hercules LLC filed Critical Hercules LLC
Publication of JPS5675642A publication Critical patent/JPS5675642A/ja
Publication of JPS6313526B2 publication Critical patent/JPS6313526B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP15395280A 1979-11-05 1980-11-04 Improved photoresist composition Granted JPS5675642A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/091,635 US4268610A (en) 1979-11-05 1979-11-05 Photoresist formulations

Publications (2)

Publication Number Publication Date
JPS5675642A true JPS5675642A (en) 1981-06-22
JPS6313526B2 JPS6313526B2 (ja) 1988-03-25

Family

ID=22228832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15395280A Granted JPS5675642A (en) 1979-11-05 1980-11-04 Improved photoresist composition

Country Status (6)

Country Link
US (1) US4268610A (ja)
JP (1) JPS5675642A (ja)
CA (1) CA1136472A (ja)
DE (1) DE3041223A1 (ja)
FR (1) FR2468933A1 (ja)
GB (1) GB2062647B (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589138A (ja) * 1981-07-10 1983-01-19 Hitachi Chem Co Ltd 感光性樹脂組成物
JPS58169144A (ja) * 1982-03-16 1983-10-05 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 光重合性エレメント
JPH08339087A (ja) * 1995-06-12 1996-12-24 Tokyo Ohka Kogyo Co Ltd ネガ型レジスト組成物及びレジストパターン形成方法
JP2010176012A (ja) * 2009-01-30 2010-08-12 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びこれを用いたレジストパターンの形成方法
JP2012212048A (ja) * 2011-03-31 2012-11-01 Taiyo Ink Mfg Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2018514614A (ja) * 2015-04-17 2018-06-07 オールネックス・ネザーランズ・ビー．ブイ．Ａｌｌｎｅｘ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 真マイケル付加架橋性組成物のための接着促進剤

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438190A (en) * 1981-03-04 1984-03-20 Hitachi Chemical Company, Ltd. Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates
US4352839A (en) * 1981-05-26 1982-10-05 General Electric Company Method of forming a layer of polymethyl methacrylate on a surface of silicon dioxide
DE3315977A1 (de) * 1983-05-02 1984-11-08 Hoechst Ag, 6230 Frankfurt Haftmasse
DE3482215D1 (de) * 1983-07-01 1990-06-13 Fuji Photo Film Co Ltd Photopolymerisierbare zusammensetzung.
US4865873A (en) * 1986-09-15 1989-09-12 General Electric Company Electroless deposition employing laser-patterned masking layer
US4950583A (en) * 1986-09-17 1990-08-21 Brewer Science Inc. Adhesion promoting product and process for treating an integrated circuit substrate therewith
GB8702732D0 (en) * 1987-02-06 1987-03-11 Hercules Inc Photopolymerisable composition
DE3717038A1 (de) * 1987-05-21 1988-12-08 Basf Ag Photopolymerisierbare aufzeichnungsmaterialien sowie photoresistschichten und flachdruckplatten auf basis dieser aufzeichnungsmaterialien
US4940608A (en) * 1988-11-07 1990-07-10 Okuno Chemical Industry Co., Ltd. Local electroless plating process for plastics
US4976817A (en) * 1988-12-09 1990-12-11 Morton International, Inc. Wet lamination process and apparatus
JPH03179356A (ja) * 1989-05-18 1991-08-05 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
DE3926708A1 (de) * 1989-08-12 1991-02-14 Basf Ag Photopolymerisierbares schichtuebertragungsmaterial
US5076946A (en) * 1990-03-30 1991-12-31 Exxon Research And Engineering Company Alkylamine substituted benzotriazole containing lubricants having improved oxidation stability and rust inhibition (PNE-530)
US5403698A (en) * 1990-10-16 1995-04-04 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition
CA2076727A1 (en) * 1991-08-30 1993-03-01 Richard T. Mayes Alkaline-etch resistant dry film photoresist
JP3010395B2 (ja) * 1991-09-04 2000-02-21 日本シイエムケイ株式会社 プリント配線板の製造方法
CA2158915A1 (en) 1994-09-30 1996-03-31 Dekai Loo Liquid photoimageable resist
US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
ATE354612T1 (de) * 1998-12-11 2007-03-15 Isola Usa Corp Sichtbares und fluoreszenzfarbstoff enthaltendes laminat
US20030143492A1 (en) * 2002-01-31 2003-07-31 Scitex Digital Printing, Inc. Mandrel with controlled release layer for multi-layer electroformed ink jet orifice plates
DE10259374A1 (de) * 2002-12-18 2004-07-08 Atto-Tec Gmbh Carboxamid-substituierte Farbstoffe für analytische Anwendungen
EP1589374B1 (en) * 2004-02-26 2008-10-01 FUJIFILM Corporation Polymerizable composition and process for producing lithographic plate using the polymerizable composition
TW200619846A (en) * 2004-08-11 2006-06-16 Hitachi Chemical Co Ltd Photosensitive resin composition and photosensitive film made with the same
US20060178676A1 (en) * 2005-02-07 2006-08-10 Anderson Paul M Skin smoothing implement
JP4850487B2 (ja) * 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
JP2012073612A (ja) * 2010-09-14 2012-04-12 Rohm & Haas Electronic Materials Llc マルチアミド成分を含むフォトレジスト
EP2995636B1 (en) 2011-10-07 2017-07-05 Allnex Netherlands B.V. A composition for use in a process for the preparation of a rma crosslinkable composition
US10017607B2 (en) 2013-04-08 2018-07-10 Allnex Netherlands B.V. Composition crosslinkable by real michael addition (RMA) reaction
KR102321564B1 (ko) 2015-04-17 2021-11-04 알넥스 네덜란드 비. 브이. Rma 가교결합성 수지 코팅을 경화하는 방법, rma 가교결합성 조성물 및 여기에 사용하기 위한 수지
CA2983148C (en) 2015-04-17 2023-05-09 Allnex Netherlands B.V. Process for the manufacture of a crosslinkable composition
KR102349137B1 (ko) 2015-04-17 2022-01-07 알넥스 네덜란드 비. 브이. 바닥 코팅 조성물

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1817107C3 (de) 1968-12-27 1980-09-11 Hoechst Ag, 6000 Frankfurt Vorsensibilisierte MehrmetaU-Offsetdruckplatte
GB1275471A (en) 1969-06-04 1972-05-24 Du Pont Improvements relating to photo-resists
US3622334A (en) * 1969-12-31 1971-11-23 Du Pont Photopolymerizable compositions and elements containing heterocyclic nitrogen-containing compounds
US3645772A (en) * 1970-06-30 1972-02-29 Du Pont Process for improving bonding of a photoresist to copper
JPS5522481B2 (ja) * 1972-12-27 1980-06-17
GB1466558A (en) * 1975-01-23 1977-03-09 Ciba Geigy Ag Additives for functional fluids
DE2529054C2 (de) * 1975-06-30 1982-04-29 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zur Herstellung eines zur Vorlage negativen Resistbildes
ZA757987B (en) * 1975-12-23 1976-12-29 Dynachem Corp Adhesion promoters for polymerizable films
GB1472527A (en) 1976-01-07 1977-05-04 Ciba Geigy Ag Additives for functional fluids

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589138A (ja) * 1981-07-10 1983-01-19 Hitachi Chem Co Ltd 感光性樹脂組成物
JPS58169144A (ja) * 1982-03-16 1983-10-05 イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− 光重合性エレメント
JPH08339087A (ja) * 1995-06-12 1996-12-24 Tokyo Ohka Kogyo Co Ltd ネガ型レジスト組成物及びレジストパターン形成方法
JP2010176012A (ja) * 2009-01-30 2010-08-12 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びこれを用いたレジストパターンの形成方法
JP2012212048A (ja) * 2011-03-31 2012-11-01 Taiyo Ink Mfg Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2018514614A (ja) * 2015-04-17 2018-06-07 オールネックス・ネザーランズ・ビー．ブイ．Ａｌｌｎｅｘ Ｎｅｔｈｅｒｌａｎｄｓ Ｂ．Ｖ． 真マイケル付加架橋性組成物のための接着促進剤
JP2021130823A (ja) * 2015-04-17 2021-09-09 オールネックス・ネザーランズ・ビー.ブイ.Allnex Netherlands B.V. 真マイケル付加架橋性組成物のための接着促進剤

Also Published As

Publication number Publication date
US4268610A (en) 1981-05-19
FR2468933A1 (fr) 1981-05-08
GB2062647A (en) 1981-05-28
DE3041223A1 (de) 1981-05-14
CA1136472A (en) 1982-11-30
FR2468933B1 (ja) 1983-07-01
GB2062647B (en) 1983-06-22
DE3041223C2 (ja) 1989-03-23
JPS6313526B2 (ja) 1988-03-25

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