JPS5671960A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS5671960A
JPS5671960A JP15018479A JP15018479A JPS5671960A JP S5671960 A JPS5671960 A JP S5671960A JP 15018479 A JP15018479 A JP 15018479A JP 15018479 A JP15018479 A JP 15018479A JP S5671960 A JPS5671960 A JP S5671960A
Authority
JP
Japan
Prior art keywords
fin
semiconductor device
small
convex
thermal resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15018479A
Other languages
Japanese (ja)
Inventor
Tsutomu Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15018479A priority Critical patent/JPS5671960A/en
Publication of JPS5671960A publication Critical patent/JPS5671960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the thermal resistance of the contacting surface of radiating plate surface and a cooling unit by making the surface about 0.05-0.12mm. convex. CONSTITUTION:A radiating plate 5 and a fin 9 are made of different materials and combined randomly to cause a small clearance therebetween. The application of a joint compound to the contacting surface thereof is effective to eliminate this defect. During the long-time use thereof, however, the compound loses the function thereof because of quality change or jutting-out. If the contacting surfaces (a) of the plate 5 with a fin 9 are 0.05-0.12mm. convex, therefore, thermal resistance and the change thereof can be kept low and small respectively even though the surface of the fin 9 has a small unevenness and undulation so that a semiconductor device is improved in reliability.
JP15018479A 1979-11-19 1979-11-19 Semiconductor device and manufacture thereof Pending JPS5671960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15018479A JPS5671960A (en) 1979-11-19 1979-11-19 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15018479A JPS5671960A (en) 1979-11-19 1979-11-19 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS5671960A true JPS5671960A (en) 1981-06-15

Family

ID=15491339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15018479A Pending JPS5671960A (en) 1979-11-19 1979-11-19 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5671960A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017047544A1 (en) * 2015-09-17 2017-03-23 富士電機株式会社 Method for manufacturing semiconductor device
JP2017059677A (en) * 2015-09-16 2017-03-23 富士電機株式会社 Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059677A (en) * 2015-09-16 2017-03-23 富士電機株式会社 Semiconductor device
WO2017047544A1 (en) * 2015-09-17 2017-03-23 富士電機株式会社 Method for manufacturing semiconductor device
JPWO2017047544A1 (en) * 2015-09-17 2017-12-21 富士電機株式会社 Manufacturing method of semiconductor device
US10098254B2 (en) 2015-09-17 2018-10-09 Fuji Electric Co., Ltd. Method of manufacturing semiconductor device

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