JPS5671934A - Semiconductor manufacturing device - Google Patents

Semiconductor manufacturing device

Info

Publication number
JPS5671934A
JPS5671934A JP14911279A JP14911279A JPS5671934A JP S5671934 A JPS5671934 A JP S5671934A JP 14911279 A JP14911279 A JP 14911279A JP 14911279 A JP14911279 A JP 14911279A JP S5671934 A JPS5671934 A JP S5671934A
Authority
JP
Japan
Prior art keywords
gas
pipe
small holes
gaps
internal walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14911279A
Other languages
Japanese (ja)
Inventor
Hiroshi Takayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP14911279A priority Critical patent/JPS5671934A/en
Publication of JPS5671934A publication Critical patent/JPS5671934A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To uniform a diffusion concentration by composing a cylindrical reactor core pipe as double wall structure wherein the gaps are used as a gas supply passage and an exhaust passage for raw material gases and many small holes are provided at internal walls and wafers vertically placed on support bases are passed through in a furnace by heating the furnace. CONSTITUTION:A quartz cylindrical reactor core pipe 11 surrounding the external circumference by heaters 29 is composed as double wall structure having internal walls 16. One end section of the gaps caused between the pipe 11 and the walls 16 are closed by covers 25 and the gaps are divided into the upper section and the lower section by bulkheads. Many small holes 20 and 19 are opened at the upper and the lower internal walls 16. The lower gap is used as a gas supply passage 21 and the upper gas as a gas exhaust passage 24. Carrier gas 22 and doping gas 23 are sent to the supply passage 21 and they are exhausted from the exhaust passage 24 through the small holes 20 after injecting them into the pipe 11 from the small holes 19. The pipe 11 is composed as the above. And support bases 20 vertically placing wafers 17 are inserted from an insertion port 12 and are taken out from a lead port 13 after finishing diffusion.
JP14911279A 1979-11-16 1979-11-16 Semiconductor manufacturing device Pending JPS5671934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14911279A JPS5671934A (en) 1979-11-16 1979-11-16 Semiconductor manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14911279A JPS5671934A (en) 1979-11-16 1979-11-16 Semiconductor manufacturing device

Publications (1)

Publication Number Publication Date
JPS5671934A true JPS5671934A (en) 1981-06-15

Family

ID=15467964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14911279A Pending JPS5671934A (en) 1979-11-16 1979-11-16 Semiconductor manufacturing device

Country Status (1)

Country Link
JP (1) JPS5671934A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136529A (en) * 1986-11-27 1988-06-08 Toshiba Corp Production device for semiconductor
US6374968B1 (en) 1999-04-22 2002-04-23 Vibrachoc Resonant device, such as a striker or load generator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136529A (en) * 1986-11-27 1988-06-08 Toshiba Corp Production device for semiconductor
US6374968B1 (en) 1999-04-22 2002-04-23 Vibrachoc Resonant device, such as a striker or load generator

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