JPS5670655A - Manufacture of electronic circuit mounting device - Google Patents

Manufacture of electronic circuit mounting device

Info

Publication number
JPS5670655A
JPS5670655A JP14842179A JP14842179A JPS5670655A JP S5670655 A JPS5670655 A JP S5670655A JP 14842179 A JP14842179 A JP 14842179A JP 14842179 A JP14842179 A JP 14842179A JP S5670655 A JPS5670655 A JP S5670655A
Authority
JP
Japan
Prior art keywords
resin
electronic part
substrate
window
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14842179A
Other languages
English (en)
Other versions
JPS5758797B2 (ja
Inventor
Isamu Kitahiro
Kazufumi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14842179A priority Critical patent/JPS5670655A/ja
Publication of JPS5670655A publication Critical patent/JPS5670655A/ja
Publication of JPS5758797B2 publication Critical patent/JPS5758797B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
    • H01L2224/9212—Sequential connecting processes
    • H01L2224/92142—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
JP14842179A 1979-11-15 1979-11-15 Manufacture of electronic circuit mounting device Granted JPS5670655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14842179A JPS5670655A (en) 1979-11-15 1979-11-15 Manufacture of electronic circuit mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14842179A JPS5670655A (en) 1979-11-15 1979-11-15 Manufacture of electronic circuit mounting device

Publications (2)

Publication Number Publication Date
JPS5670655A true JPS5670655A (en) 1981-06-12
JPS5758797B2 JPS5758797B2 (ja) 1982-12-11

Family

ID=15452412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14842179A Granted JPS5670655A (en) 1979-11-15 1979-11-15 Manufacture of electronic circuit mounting device

Country Status (1)

Country Link
JP (1) JPS5670655A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0171662A2 (en) * 1984-08-13 1986-02-19 International Business Machines Corporation Method of fabricating a chip interposer
US4724611A (en) * 1985-08-23 1988-02-16 Nec Corporation Method for producing semiconductor module
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
US4945980A (en) * 1988-09-09 1990-08-07 Nec Corporation Cooling unit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
US5023695A (en) * 1988-05-09 1991-06-11 Nec Corporation Flat cooling structure of integrated circuit
US5036384A (en) * 1987-12-07 1991-07-30 Nec Corporation Cooling system for IC package
JP2013514637A (ja) * 2009-12-18 2013-04-25 シュバイツァー エレクトロニク アーゲー 導体構造要素及び導体構造要素を製造するための方法
JP2014086246A (ja) * 2012-10-23 2014-05-12 Nippon Mektron Ltd バスバー付きフレキシブルプリント配線板およびその製造方法、並びにバッテリシステム
EP4020533A3 (en) * 2020-12-25 2022-09-21 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0171662A2 (en) * 1984-08-13 1986-02-19 International Business Machines Corporation Method of fabricating a chip interposer
US4724611A (en) * 1985-08-23 1988-02-16 Nec Corporation Method for producing semiconductor module
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
US5036384A (en) * 1987-12-07 1991-07-30 Nec Corporation Cooling system for IC package
US5023695A (en) * 1988-05-09 1991-06-11 Nec Corporation Flat cooling structure of integrated circuit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
US4945980A (en) * 1988-09-09 1990-08-07 Nec Corporation Cooling unit
US5014777A (en) * 1988-09-20 1991-05-14 Nec Corporation Cooling structure
JP2013514637A (ja) * 2009-12-18 2013-04-25 シュバイツァー エレクトロニク アーゲー 導体構造要素及び導体構造要素を製造するための方法
JP2014086246A (ja) * 2012-10-23 2014-05-12 Nippon Mektron Ltd バスバー付きフレキシブルプリント配線板およびその製造方法、並びにバッテリシステム
US10084211B2 (en) 2012-10-23 2018-09-25 Nippon Mektron, Ltd. Flexible printed circuit with bus bars, manufacturing method thereof, and battery system
EP4020533A3 (en) * 2020-12-25 2022-09-21 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing same
US11742272B2 (en) 2020-12-25 2023-08-29 Shinko Electric Industries Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPS5758797B2 (ja) 1982-12-11

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