JPS6414991A - Manufacture of circuit module - Google Patents
Manufacture of circuit moduleInfo
- Publication number
- JPS6414991A JPS6414991A JP16963687A JP16963687A JPS6414991A JP S6414991 A JPS6414991 A JP S6414991A JP 16963687 A JP16963687 A JP 16963687A JP 16963687 A JP16963687 A JP 16963687A JP S6414991 A JPS6414991 A JP S6414991A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- supporting plate
- ultraviolet rays
- adhesion
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To improve the position accuracy of components in a substrate, to make possible a highly integrated packaging and to facilitate the peeling of a supporting plate by a method wherein ultraviolet rays are irradiated from the side of the supporting plate to cure an ultraviolet curing resin and at the same time, the adhesion of the supporting plate is reduced by the ultraviolet rays. CONSTITUTION:Electronic components, such as an IC 2, chip diodes 3 and chip resistors 4, are arranged on a supporting plate 1 having an adhesion, which is reduced by irradiating ultraviolet rays, and light transmission properties, spacers 5 consisting of Teflon are arranged on the peripheries of the plate 1, an ultraviolet curing resin 6 is relayed on the peripheries of the components 2-4 and moreover, the upper part of the resin 6 is covered with a Teflon flat plate 7 of a thickness of 5mm or thereabouts. Ultraviolet rays are irradiated from the side of the plate 1 and with the resin 6 cured, the adhesion of the plate 1 is reduced and a cured ultraviolet curing resin 8 is used as a circuit module substrate. Then, the plates 1 and 7 and the spacers 5 are peeled and a silver paste is subjected to a screen printing on the substrate 8 to form desired conductor patterns 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16963687A JPS6414991A (en) | 1987-07-09 | 1987-07-09 | Manufacture of circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16963687A JPS6414991A (en) | 1987-07-09 | 1987-07-09 | Manufacture of circuit module |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6414991A true JPS6414991A (en) | 1989-01-19 |
Family
ID=15890168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16963687A Pending JPS6414991A (en) | 1987-07-09 | 1987-07-09 | Manufacture of circuit module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6414991A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661417A (en) * | 1992-06-10 | 1994-03-04 | Origin Electric Co Ltd | Semiconductor device, electronic circuit device, and method and device for manufacturing them |
JP2005039195A (en) * | 2003-06-26 | 2005-02-10 | Nippon Sheet Glass Co Ltd | Manufacturing method of light emitting element with built-in lens |
-
1987
- 1987-07-09 JP JP16963687A patent/JPS6414991A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661417A (en) * | 1992-06-10 | 1994-03-04 | Origin Electric Co Ltd | Semiconductor device, electronic circuit device, and method and device for manufacturing them |
JP2005039195A (en) * | 2003-06-26 | 2005-02-10 | Nippon Sheet Glass Co Ltd | Manufacturing method of light emitting element with built-in lens |
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