JPS6414991A - Manufacture of circuit module - Google Patents

Manufacture of circuit module

Info

Publication number
JPS6414991A
JPS6414991A JP16963687A JP16963687A JPS6414991A JP S6414991 A JPS6414991 A JP S6414991A JP 16963687 A JP16963687 A JP 16963687A JP 16963687 A JP16963687 A JP 16963687A JP S6414991 A JPS6414991 A JP S6414991A
Authority
JP
Japan
Prior art keywords
plate
supporting plate
ultraviolet rays
adhesion
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16963687A
Other languages
Japanese (ja)
Inventor
Akinori Motomiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16963687A priority Critical patent/JPS6414991A/en
Publication of JPS6414991A publication Critical patent/JPS6414991A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the position accuracy of components in a substrate, to make possible a highly integrated packaging and to facilitate the peeling of a supporting plate by a method wherein ultraviolet rays are irradiated from the side of the supporting plate to cure an ultraviolet curing resin and at the same time, the adhesion of the supporting plate is reduced by the ultraviolet rays. CONSTITUTION:Electronic components, such as an IC 2, chip diodes 3 and chip resistors 4, are arranged on a supporting plate 1 having an adhesion, which is reduced by irradiating ultraviolet rays, and light transmission properties, spacers 5 consisting of Teflon are arranged on the peripheries of the plate 1, an ultraviolet curing resin 6 is relayed on the peripheries of the components 2-4 and moreover, the upper part of the resin 6 is covered with a Teflon flat plate 7 of a thickness of 5mm or thereabouts. Ultraviolet rays are irradiated from the side of the plate 1 and with the resin 6 cured, the adhesion of the plate 1 is reduced and a cured ultraviolet curing resin 8 is used as a circuit module substrate. Then, the plates 1 and 7 and the spacers 5 are peeled and a silver paste is subjected to a screen printing on the substrate 8 to form desired conductor patterns 9.
JP16963687A 1987-07-09 1987-07-09 Manufacture of circuit module Pending JPS6414991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16963687A JPS6414991A (en) 1987-07-09 1987-07-09 Manufacture of circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16963687A JPS6414991A (en) 1987-07-09 1987-07-09 Manufacture of circuit module

Publications (1)

Publication Number Publication Date
JPS6414991A true JPS6414991A (en) 1989-01-19

Family

ID=15890168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16963687A Pending JPS6414991A (en) 1987-07-09 1987-07-09 Manufacture of circuit module

Country Status (1)

Country Link
JP (1) JPS6414991A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661417A (en) * 1992-06-10 1994-03-04 Origin Electric Co Ltd Semiconductor device, electronic circuit device, and method and device for manufacturing them
JP2005039195A (en) * 2003-06-26 2005-02-10 Nippon Sheet Glass Co Ltd Manufacturing method of light emitting element with built-in lens

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661417A (en) * 1992-06-10 1994-03-04 Origin Electric Co Ltd Semiconductor device, electronic circuit device, and method and device for manufacturing them
JP2005039195A (en) * 2003-06-26 2005-02-10 Nippon Sheet Glass Co Ltd Manufacturing method of light emitting element with built-in lens

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