JPS6442154A - Packaging method for ic chip - Google Patents

Packaging method for ic chip

Info

Publication number
JPS6442154A
JPS6442154A JP19839987A JP19839987A JPS6442154A JP S6442154 A JPS6442154 A JP S6442154A JP 19839987 A JP19839987 A JP 19839987A JP 19839987 A JP19839987 A JP 19839987A JP S6442154 A JPS6442154 A JP S6442154A
Authority
JP
Japan
Prior art keywords
insulating substrate
chip
electrode
pushed
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19839987A
Other languages
Japanese (ja)
Inventor
Fumiaki Yamada
Hiroaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19839987A priority Critical patent/JPS6442154A/en
Publication of JPS6442154A publication Critical patent/JPS6442154A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the number of adhesion processes and improve the operation rate of a machine facility, by fixing a mold case to the surface of the insulating substrate by a magnet applied from the back side of an insulating substrate after an IC chip is covered with the mold case containing a magnetic substance in such a manner that it is pushed to an electrode. CONSTITUTION:An IC chip 4 is mounted on an electrode 2 formed on the main surface of the insulating substrate 1 through an anisotropic conductive sheet 3 and the IC chip 4 is covered with a mold case 7 containing a magnetic substance 8 such that it is pushed to an electrode 2. Then, the mold case 7 is fixed to the surface of the insulating substrate 1 by a magnet 9 applied from the back side of the insulating substrate 1 to adhere the mdd case 7 to the insulating substrate 1. It becomes possible to perform collective ultraviolet-ray curing operation by one irradiation with ultraviolet rays from the back side of the insulating substrate by fixing the respective mold cases, in the state in which the IC chip is pushed to each electrode of the same insulating substrate, to the insulating substrate separately using a magnet, so that it becomes possible to reduce the cost by reducing the number of processes with the reduction of adhesions and improving the operation rate of a machine facility.
JP19839987A 1987-08-07 1987-08-07 Packaging method for ic chip Pending JPS6442154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19839987A JPS6442154A (en) 1987-08-07 1987-08-07 Packaging method for ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19839987A JPS6442154A (en) 1987-08-07 1987-08-07 Packaging method for ic chip

Publications (1)

Publication Number Publication Date
JPS6442154A true JPS6442154A (en) 1989-02-14

Family

ID=16390482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19839987A Pending JPS6442154A (en) 1987-08-07 1987-08-07 Packaging method for ic chip

Country Status (1)

Country Link
JP (1) JPS6442154A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013493A (en) * 2010-06-30 2012-01-19 Denso Corp Manufacturing method for wafer level package structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013493A (en) * 2010-06-30 2012-01-19 Denso Corp Manufacturing method for wafer level package structures

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