JPS6442154A - Packaging method for ic chip - Google Patents
Packaging method for ic chipInfo
- Publication number
- JPS6442154A JPS6442154A JP19839987A JP19839987A JPS6442154A JP S6442154 A JPS6442154 A JP S6442154A JP 19839987 A JP19839987 A JP 19839987A JP 19839987 A JP19839987 A JP 19839987A JP S6442154 A JPS6442154 A JP S6442154A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- chip
- electrode
- pushed
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To reduce the number of adhesion processes and improve the operation rate of a machine facility, by fixing a mold case to the surface of the insulating substrate by a magnet applied from the back side of an insulating substrate after an IC chip is covered with the mold case containing a magnetic substance in such a manner that it is pushed to an electrode. CONSTITUTION:An IC chip 4 is mounted on an electrode 2 formed on the main surface of the insulating substrate 1 through an anisotropic conductive sheet 3 and the IC chip 4 is covered with a mold case 7 containing a magnetic substance 8 such that it is pushed to an electrode 2. Then, the mold case 7 is fixed to the surface of the insulating substrate 1 by a magnet 9 applied from the back side of the insulating substrate 1 to adhere the mdd case 7 to the insulating substrate 1. It becomes possible to perform collective ultraviolet-ray curing operation by one irradiation with ultraviolet rays from the back side of the insulating substrate by fixing the respective mold cases, in the state in which the IC chip is pushed to each electrode of the same insulating substrate, to the insulating substrate separately using a magnet, so that it becomes possible to reduce the cost by reducing the number of processes with the reduction of adhesions and improving the operation rate of a machine facility.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19839987A JPS6442154A (en) | 1987-08-07 | 1987-08-07 | Packaging method for ic chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19839987A JPS6442154A (en) | 1987-08-07 | 1987-08-07 | Packaging method for ic chip |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6442154A true JPS6442154A (en) | 1989-02-14 |
Family
ID=16390482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19839987A Pending JPS6442154A (en) | 1987-08-07 | 1987-08-07 | Packaging method for ic chip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6442154A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012013493A (en) * | 2010-06-30 | 2012-01-19 | Denso Corp | Manufacturing method for wafer level package structures |
-
1987
- 1987-08-07 JP JP19839987A patent/JPS6442154A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012013493A (en) * | 2010-06-30 | 2012-01-19 | Denso Corp | Manufacturing method for wafer level package structures |
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