JPS6487680A - Surface treatment of bonding object - Google Patents

Surface treatment of bonding object

Info

Publication number
JPS6487680A
JPS6487680A JP24255187A JP24255187A JPS6487680A JP S6487680 A JPS6487680 A JP S6487680A JP 24255187 A JP24255187 A JP 24255187A JP 24255187 A JP24255187 A JP 24255187A JP S6487680 A JPS6487680 A JP S6487680A
Authority
JP
Japan
Prior art keywords
bonding
treatment
laser beam
plane
adhesive strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24255187A
Other languages
Japanese (ja)
Inventor
Kiyotaka Okinari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24255187A priority Critical patent/JPS6487680A/en
Publication of JPS6487680A publication Critical patent/JPS6487680A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To easily decomposed and remove unnecessary materials such as releasing agent without using an organic solvent or hydrogen flame, etc., and to improve adhesive strength of a bonding face of a printed circuit board of a plane-packaged electronic parts, etc., by heat-treating a bonding surface with laser beam beforehand. CONSTITUTION:Preferably >=50% of the bonding area of a plane-packaged integrated circuit element, etc., is irradiated with laser beam to effect the heat- treatment of the surface. The layer of a releasing agent can be eliminated and the surface can be roughened by this treatment to improve the adhesive strength and eliminate the defect caused by registration error.
JP24255187A 1987-09-29 1987-09-29 Surface treatment of bonding object Pending JPS6487680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24255187A JPS6487680A (en) 1987-09-29 1987-09-29 Surface treatment of bonding object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24255187A JPS6487680A (en) 1987-09-29 1987-09-29 Surface treatment of bonding object

Publications (1)

Publication Number Publication Date
JPS6487680A true JPS6487680A (en) 1989-03-31

Family

ID=17090785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24255187A Pending JPS6487680A (en) 1987-09-29 1987-09-29 Surface treatment of bonding object

Country Status (1)

Country Link
JP (1) JPS6487680A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330296A (en) * 2003-06-20 2005-12-02 Hitachi Chem Co Ltd Connecting method of adhesive material tape
JP2012017358A (en) * 2010-07-06 2012-01-26 New Tac Kasei Co Ltd Coreless adhesive tape roll

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005330296A (en) * 2003-06-20 2005-12-02 Hitachi Chem Co Ltd Connecting method of adhesive material tape
JP2012017358A (en) * 2010-07-06 2012-01-26 New Tac Kasei Co Ltd Coreless adhesive tape roll

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