JPS5669850A - Method for sealing semiconductor device - Google Patents
Method for sealing semiconductor deviceInfo
- Publication number
- JPS5669850A JPS5669850A JP14508679A JP14508679A JPS5669850A JP S5669850 A JPS5669850 A JP S5669850A JP 14508679 A JP14508679 A JP 14508679A JP 14508679 A JP14508679 A JP 14508679A JP S5669850 A JPS5669850 A JP S5669850A
- Authority
- JP
- Japan
- Prior art keywords
- finger parts
- parts
- bonded
- thin
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14508679A JPS5669850A (en) | 1979-11-09 | 1979-11-09 | Method for sealing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14508679A JPS5669850A (en) | 1979-11-09 | 1979-11-09 | Method for sealing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5669850A true JPS5669850A (en) | 1981-06-11 |
Family
ID=15377051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14508679A Pending JPS5669850A (en) | 1979-11-09 | 1979-11-09 | Method for sealing semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5669850A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057456A (en) * | 1988-08-23 | 1991-10-15 | Bull, S.A. | Method of manufacturing a tab semiconductor package by securing a thin insulating frame to inner leads of the package |
FR2674681A1 (fr) * | 1991-03-28 | 1992-10-02 | Em Microelectronic Marin Sa | Composant electronique ultramince et procede pour sa fabrication. |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441671A (en) * | 1977-09-08 | 1979-04-03 | Sharp Corp | Semiconductor device |
JPS5716738A (en) * | 1981-04-30 | 1982-01-28 | Sharp Corp | Temperature control device |
-
1979
- 1979-11-09 JP JP14508679A patent/JPS5669850A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441671A (en) * | 1977-09-08 | 1979-04-03 | Sharp Corp | Semiconductor device |
JPS5716738A (en) * | 1981-04-30 | 1982-01-28 | Sharp Corp | Temperature control device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057456A (en) * | 1988-08-23 | 1991-10-15 | Bull, S.A. | Method of manufacturing a tab semiconductor package by securing a thin insulating frame to inner leads of the package |
FR2674681A1 (fr) * | 1991-03-28 | 1992-10-02 | Em Microelectronic Marin Sa | Composant electronique ultramince et procede pour sa fabrication. |
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