JPS5665956A - Conductor alloy for integrated circuit and its manufacture - Google Patents
Conductor alloy for integrated circuit and its manufactureInfo
- Publication number
- JPS5665956A JPS5665956A JP14135979A JP14135979A JPS5665956A JP S5665956 A JPS5665956 A JP S5665956A JP 14135979 A JP14135979 A JP 14135979A JP 14135979 A JP14135979 A JP 14135979A JP S5665956 A JPS5665956 A JP S5665956A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- alloy
- manufacture
- conductor alloy
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE: To obtain a conductor alloy for an integrated circuit with high strength, high electrical conductivity and superior economical efficiency by melting a Cu alloy material having a specified composition contg. Cr, Fe or Co, etc. followed by quench-casting, hot working at a specified temp. and slow cooling.
CONSTITUTION: A Cu alloy material consisting of, by wt., 0.8W5% Cr, 1W9% Fe or 0.5W4% Co, 0.1W0.5% at least one selected from Mn, Sn, Si and Sb, and the balance Cu is melted and quench-cast to make the grains fine. The cast material is then hot worked into a predetermined form at ≤600°C and slowly cooled to economically manufacture a conductor alloy for an integrated circuit with high strength and high electrical conductivity.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14135979A JPS5844737B2 (en) | 1979-11-02 | 1979-11-02 | Manufacturing method of conductor alloy for integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14135979A JPS5844737B2 (en) | 1979-11-02 | 1979-11-02 | Manufacturing method of conductor alloy for integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5665956A true JPS5665956A (en) | 1981-06-04 |
JPS5844737B2 JPS5844737B2 (en) | 1983-10-05 |
Family
ID=15290139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14135979A Expired JPS5844737B2 (en) | 1979-11-02 | 1979-11-02 | Manufacturing method of conductor alloy for integrated circuits |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5844737B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893860A (en) * | 1981-11-30 | 1983-06-03 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of high strength copper alloy with high electric conductivity |
CN109777994A (en) * | 2019-04-01 | 2019-05-21 | 宁波金田铜业(集团)股份有限公司 | A kind of electronic shield copper alloy wire and its preparation method and application |
-
1979
- 1979-11-02 JP JP14135979A patent/JPS5844737B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893860A (en) * | 1981-11-30 | 1983-06-03 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of high strength copper alloy with high electric conductivity |
JPS619385B2 (en) * | 1981-11-30 | 1986-03-22 | Nippon Denshin Denwa Kk | |
CN109777994A (en) * | 2019-04-01 | 2019-05-21 | 宁波金田铜业(集团)股份有限公司 | A kind of electronic shield copper alloy wire and its preparation method and application |
Also Published As
Publication number | Publication date |
---|---|
JPS5844737B2 (en) | 1983-10-05 |
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