JPS5665956A - Conductor alloy for integrated circuit and its manufacture - Google Patents

Conductor alloy for integrated circuit and its manufacture

Info

Publication number
JPS5665956A
JPS5665956A JP14135979A JP14135979A JPS5665956A JP S5665956 A JPS5665956 A JP S5665956A JP 14135979 A JP14135979 A JP 14135979A JP 14135979 A JP14135979 A JP 14135979A JP S5665956 A JPS5665956 A JP S5665956A
Authority
JP
Japan
Prior art keywords
integrated circuit
alloy
manufacture
conductor alloy
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14135979A
Other languages
Japanese (ja)
Other versions
JPS5844737B2 (en
Inventor
Kishio Arita
Toshio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP14135979A priority Critical patent/JPS5844737B2/en
Publication of JPS5665956A publication Critical patent/JPS5665956A/en
Publication of JPS5844737B2 publication Critical patent/JPS5844737B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: To obtain a conductor alloy for an integrated circuit with high strength, high electrical conductivity and superior economical efficiency by melting a Cu alloy material having a specified composition contg. Cr, Fe or Co, etc. followed by quench-casting, hot working at a specified temp. and slow cooling.
CONSTITUTION: A Cu alloy material consisting of, by wt., 0.8W5% Cr, 1W9% Fe or 0.5W4% Co, 0.1W0.5% at least one selected from Mn, Sn, Si and Sb, and the balance Cu is melted and quench-cast to make the grains fine. The cast material is then hot worked into a predetermined form at ≤600°C and slowly cooled to economically manufacture a conductor alloy for an integrated circuit with high strength and high electrical conductivity.
COPYRIGHT: (C)1981,JPO&Japio
JP14135979A 1979-11-02 1979-11-02 Manufacturing method of conductor alloy for integrated circuits Expired JPS5844737B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14135979A JPS5844737B2 (en) 1979-11-02 1979-11-02 Manufacturing method of conductor alloy for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14135979A JPS5844737B2 (en) 1979-11-02 1979-11-02 Manufacturing method of conductor alloy for integrated circuits

Publications (2)

Publication Number Publication Date
JPS5665956A true JPS5665956A (en) 1981-06-04
JPS5844737B2 JPS5844737B2 (en) 1983-10-05

Family

ID=15290139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14135979A Expired JPS5844737B2 (en) 1979-11-02 1979-11-02 Manufacturing method of conductor alloy for integrated circuits

Country Status (1)

Country Link
JP (1) JPS5844737B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893860A (en) * 1981-11-30 1983-06-03 Nippon Telegr & Teleph Corp <Ntt> Manufacture of high strength copper alloy with high electric conductivity
CN109777994A (en) * 2019-04-01 2019-05-21 宁波金田铜业(集团)股份有限公司 A kind of electronic shield copper alloy wire and its preparation method and application

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893860A (en) * 1981-11-30 1983-06-03 Nippon Telegr & Teleph Corp <Ntt> Manufacture of high strength copper alloy with high electric conductivity
JPS619385B2 (en) * 1981-11-30 1986-03-22 Nippon Denshin Denwa Kk
CN109777994A (en) * 2019-04-01 2019-05-21 宁波金田铜业(集团)股份有限公司 A kind of electronic shield copper alloy wire and its preparation method and application

Also Published As

Publication number Publication date
JPS5844737B2 (en) 1983-10-05

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