JPS55154541A - High-tensile electrically-conductive copper alloy having low softening temperature - Google Patents
High-tensile electrically-conductive copper alloy having low softening temperatureInfo
- Publication number
- JPS55154541A JPS55154541A JP6280779A JP6280779A JPS55154541A JP S55154541 A JPS55154541 A JP S55154541A JP 6280779 A JP6280779 A JP 6280779A JP 6280779 A JP6280779 A JP 6280779A JP S55154541 A JPS55154541 A JP S55154541A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- tensile
- electrically
- low softening
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 238000000137 annealing Methods 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Landscapes
- Conductive Materials (AREA)
Abstract
PURPOSE: To provide a Cu alloy having high strength, superior workability and a low softening temp. by adding a specified amount of Co and B to Cu.
CONSTITUTION: Co 0.2W3.0% and B 0.001W0.1% are added to Cu and alloyed. By adding Co within the above-mentioned range the strength of the resulting alloy is enhanced without deteriorating the castability and workability. A rise in softening temp. of the alloy due to addition of Co is prevented by adding B. Accordingly, this Cu alloy has high strength and superior workability, and the softening temp. is not high, so it is not required to raise the annealing temp., and no heat energy is lost. This alloy is suitable for use as a material for a heat exchanger, wiring equipment, electric and electronic parts, etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6280779A JPS55154541A (en) | 1979-05-22 | 1979-05-22 | High-tensile electrically-conductive copper alloy having low softening temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6280779A JPS55154541A (en) | 1979-05-22 | 1979-05-22 | High-tensile electrically-conductive copper alloy having low softening temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55154541A true JPS55154541A (en) | 1980-12-02 |
Family
ID=13210969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6280779A Pending JPS55154541A (en) | 1979-05-22 | 1979-05-22 | High-tensile electrically-conductive copper alloy having low softening temperature |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55154541A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003098641A1 (en) * | 2002-05-17 | 2003-11-27 | Idemitsu Kousan Co., Ltd. | Wiring material and wiring board using the same |
-
1979
- 1979-05-22 JP JP6280779A patent/JPS55154541A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003098641A1 (en) * | 2002-05-17 | 2003-11-27 | Idemitsu Kousan Co., Ltd. | Wiring material and wiring board using the same |
| CN100365737C (en) * | 2002-05-17 | 2008-01-30 | 出光兴产株式会社 | Wiring material and wiring board using the same |
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